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From Technologies to Markets
© 2021
From Technologies to Markets
Memory
Packaging
Market and Technology
Report 2021
Sample
2
2
o Mobile 158
o Personal Computer (Client) 168
o Consumer 175
o Automotive 183
• Memory Packaging Forecast 193
o NAND Packaging Market Forecast – in $M, units, and wafers 204
o DRAM Packaging Market Forecast – in $M, units, and wafers 212
o Other Stand-Alone Memory Packaging Forecast 220
• Ecosystem 230
o Supply Chain Mapping 231
o Supply Chain Challenges – Focus on Shortages 240
o M&A and Partnerships 249
• China’s Memory Business 254
• Advanced Packaging for Memory-Logic Integration 276
• Hybrid Bonding - Overview 295
• Packaging Materials - Overview 311
• General Conclusions 321
• Noteworthy News 325
• How to use our data? 331
• Yole Presentation 332
• Glossary and Definitions 2
• Table of Contents 10
• Report Objectives 11
• Scope of the Report 12
• Methodology & Definitions 13
• About the Authors 14
• Companies Cited in this Report 15
• Comparison with the 2017 Report 16
• Who Should Be Interested in This Report 17
• Yole Group Related Reports 18
• Three-Slide Summary 20
• Executive Summary 24
• Context – Overview of the Memory Business 65
o Stand-Alone Memory Technology and Market 72
o Stand-Alone Memory Market Players 83
• Overview of Memory Packaging 96
o Memory Packaging Technology 107
o Memory Packaging Players 133
• Memory Packaging Trends by End Markets 148
o Datacenter 151
Memory Packaging | Sample | www.yole.fr | ©2021
TABLE OF CONTENTS
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Memory Packaging | Sample | www.yole.fr | ©2021
COMPANIES CITED IN THIS REPORT
Amkor,Applied Materials,Ardentec,ASE,ASML,Avalanche, Canon, Carsem, Centon, ChipbondTechnology,
ChipMOS Technologies, CXMT, Dialog Semiconductor, Dosilicon, ESMT, Etron, Everspin, Formosa Advanced
Technologies, Fujitsu, GigaDevice, GlobalFoundries, Greatek Elec, Hana Micron, H-Grace, Hitachi, HLMC, IBM, IDT,
Inari Berhad, Infineon-Cypress, Intel, ISSI, Jiangsu Silicon Integrity SemiconductorTechnology, JCET Group, JHICC,
KingYuan Electronics, Kingston, Kioxia, KLA Tencor, Lam Research, Lapis, LB Semicon, Lingsen Precision Industries,
Liteon, Longsys, Macronix, Marvell, Maxim, Maxio, MediaTek, Microchi, Micron, Montage, Nanya, NEC, Nepes
Corporation, NetApp, NetList, Nuvoton-Panasonic, Orient Semiconductor Electronics, Phison, Powerchip,
PowertechTechnology, Rambus, Realtek, Renesas, Samsung, Seagate, SFA Semicon, Signetics, Sigurd
Microelectronics, Silicon Motion, SJ Semi, SK Hynix, Smart Modular, SMIC, Sony, Spin memory, STMicroelectronics,
Swissbit,TEL,Texas Instruments,Tianshui Huatian Microelectronics,Tong Hsing,Tongfu Microelectronics,
Transcend,TSMC, UMC, Unisem Berhad, UTAC,Viking,Violin Memory,Walton Advanced Engineering,Weebit,
Winbond,WLCSP, XMC,YMTC, and more.
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4
Simone Bertolazzi,Ph.D.
Simone is a Senior Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of
Yole’s memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and fabrication
processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting
materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the prestigious
Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland),
where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics. Simone earned a double M. A. Sc.
degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Email: simone.bertolazzi@yole.fr
Thomas Illner
As a Technology and Market Analyst Intern, Thomas Illner is member of the Semiconductor, Memory & Computing at Yole Développement (Yole), part
of Yole Group of Companies. Thomas performs, in collaboration with his team, a strategic and technical analysis of the memory packaging and
materials related to the packaging. Prior to Yole, Thomas worked as an intern at Sartorius Stedim Biotech on the irradiation of biomedical films
materials. Thomas holds a Physics and Chemical engineer degree with a specialization in polymers sciences at the European School of Chemistry of
Strasbourg, France. He is preparing an MBA as complementary degree at the EM Strasbourg.
Email: thomas.illner@yole.fr
Memory Packaging | Sample | www.yole.fr | ©2021
Biographies & contacts
ABOUT THE AUTHORS
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Memory Packaging | Sample | www.yole.fr | ©2021
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
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Memory Packaging | Sample | www.yole.fr | ©2021
SCOPE OFTHE REPORT – MARKET ANALYSISWITH BREAKDOWN BY:
MemoryTechnologies PackagingTechnologies End Markets
DRAM
NAND
NOR and other
technologies (EEPROM,
EPROM, ROM, etc.)
PCM, ReRAM, MRAM
Leadframe
Wirebond
(organic substrate)
Flip Chip
CPU
3DTSV DRAM
TSV HBM
Hybrid Bonding (XtackingTM)
WLCSP
Consumer
Mobile
Datacenter
Automotive
PC/Client
Your needs are
out of scope of this
report?
Contact us for a custom study:
Notes: (1) Multiple package on board / PCB in module format (e.g. DIMM ) is not included in the market forecast. (2) Packaging
revenues (substrate, assembly, stacking, TSV formation, bumping, etc.) are included in the market forecast but not testing.
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Memory Packaging | Sample | www.yole.fr | ©2021
REPORT OBJECTIVES
Yole has combined its multi-decade expertise in semiconductor packaging and memory technologies/markets to deliver
the new edition of the “Memory Packaging” report, which has the following main objectives:
• Present an overview of the semiconductor memory market:
• Market trends for DRAM, NAND, NOR, (NV)SRAM, emerging NVM and other stand-alone memory technologies.
• Provide an understanding of memory packaging technologies and markets:
• Technical characteristics, manufacturing methods, advantages/limitations, development status for a variety of packaging approaches,
among which leadframe, wirebond,WLCSP, flip chip,TSV-based stacking (HBM and 3DS) and hybrid bonding (YMTC’s 3D NAND).
• Packaging trends for 5 different end-markets: datacenter, PC, mobile, consumer and automotive.
• Packaging trends for DRAM, NAND and other stand-alone technologies,including NOR Flash, MRAM, PCM, ReRAM, and more.
• Offer market forecasts for the memory packaging :
• 2020-2026 market forecast: revenue (US$), volume (number of packages) and wafer shipments with breakdown by type of package,
type of memory technology, as well as end-market.
• Evolution of ASP and number of dies-per-package by type of package, type of memory technology and end-market.
• Describe the memory packaging business:
• Market drivers, challenges, opportunities and technology requirements for 5 end-markets, roadmaps and players.
• Analysis of the memory packaging supply chain and players’ dynamics with focus on OSATs and memory IDMs.
• Detail and analyze the competitive landscape:
• Recent acquisitions and funding, latest company news, key players by technology and application.
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COMPARISON WITHTHE PREVIOUS EDITION OFTHE REPORT (2017)
What we saw, what we missed
What we saw:
o Market:
• The total stand-alone memory wafer production was correctly predicted to rise to ~35M wafers (12’’) in 2020.
o Players
• The rising Chinese memory IDMs are indeed fueling a strong business opportunity for OSATs in China. YMTC (Wuhan, NAND)
and CXMT (Hefei, DRAM) do not have fully-developed assembly/testing divisions, so they need to outsource all their memory
packaging to OSATs.This is a strong tailwind for JCET, HT-Tech andTongFu.
o Technologies
• The growing penetration of flip-chip packages for PC and server DRAM was captured correctly. As anticipated, TSV-based
stacking of NAND devices – introduced byToshiba (Kioxia) in 2017 – had a negligible market penetration.
What we missed:
o Market
• In the last 4 years, the memory market went through a rapid growth and subsequent decline. After hitting record high revenues
in 2017 and 2018, the memory industry entered an oversupply condition. 2019 was a year of deep decline (revenues down 34%).
• Note: the overall memory packaging market reported in 2017 included the ASP contribution of testing. In the current edition,
we disentangled the different contributions to provide only the packaging-related revenues.
o Technologies
• In 2017, we underestimated the evolution of the average number of dies per package for NAND and DRAM, and consequently
we overestimated the package volume. We revised such data through the analysis of a large number of devices and systems in
collaboration with our reverse-engineering partner System Plus Consulting.
Memory Packaging | Sample | www.yole.fr | ©2021
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OVERVIEW OFTHE MEMORY BUSINESS
Memory Packaging | Sample | www.yole.fr | ©2021
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Memory Packaging | Sample | www.yole.fr | ©2021
MEMORY PACKAGING PLATFORMS
Different types of package integration
Semiconductor
Package
Single Die Package
Multi Die Package
Homogeneous
Stacking
Heterogenous
Stacking
PoP format
MCP
Multiple package
on board / PCB in
module format
(e.g., DIMM )
Not included in
the forecast
(e.g. DRAM die stack or NAND die stack)
(e.g., DRAM and AP in smartphones)
(e.g., UFS or eMMC controller + NAND dies +DRAM dies)
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MEMORY PACKAGING TECHNOLOGIES
Memory Packaging | Sample | www.yole.fr | ©2021
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MEMORY PACKAGING TECHNOLOGY – FOCUS ON MOBILE
Key goals: thinness, minimum footprint-on-board, low cost and high bit density
APU
Substrate
NAND-based MCP
NAND
LPDDR
3D NAND
eMMC
controller APU
Substrate
eMMC
PoP
LPDDR
3D NAND
eMMC controller
Substrate
eMCP
LPDDR
APU
3D NAND
eMMC controller
Substrate
ePoP
LPDDR
APU
3D NAND
UFS
controller APU
Substrate
UFS
PoP
LPDDR
3D NAND
UFS controller
Substrate
uMCP
LPDDR
APU
Memory Packaging | Sample | www.yole.fr | ©2021
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MEMORY PACKAGING PLAYERS
Memory Packaging | Sample | www.yole.fr | ©2021
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MEMORY PACKAGING PLAYERS – IDMs AND OSATs
IDMs vs OSATs memory packaging revenue
IDMs are doing
most of their
memory
packaging in
house.We
estimate that less
than ¼ of the
memory
packaging market
are currently
generated by
OSATS.
Memory Packaging | Sample | www.yole.fr | ©2021
IDMs OSATs - packaging for non-Chinese IDMs OSATs - packaging for Chinese IDMs
2020
$13.1B
2026
$19.8B
68%
31%
1%
65%
29%
6%
CAGR20-26 ≈ 7%
15
15
15
• Two opposite trends are influencing the memory-packaging business carried out by OSATs:
• Chinese players –YMTC and CXMT – are ramping up their memory capacity boosting memory-capacity demand to OSATs.
• Following Samsung and SK hynix, Micron has started the conversion of DRAM packaging from wirebond to flip chip increasing
its internal back-end capacity.This implies less outsourcing to OSATs.
Memory Packaging | Sample | www.yole.fr | ©2021
MEMORY PACKAGING REVENUE – IDMsVERSUS OSATs
Estimated evolution of revenues by OSATs and IDMs
OSAT $ ↑
OSAT $ ↓
Memory Packaging Market in $M Memory Packaging Market - IDM vs OSAT Breakdown
16
2020-2026 DRAM PACKAGING MARKET FORECAST
In US$ and units (# of packages and # of 12’’ wafers)
Memory Packaging | Sample | www.yole.fr | ©2021
PC
Datacenter
Mobile
Consumer
Auto
Other
CAGR20-26 ≈ X%
$XX
$XX $XX
2020 2026
$XXB
Leadframe
Wirebond – Discrete
Wirebond – MCP
Flip Chip
WLCSP
TSV – 3DS
TSV - HBM
Flip chip is the
leading type of
package for
DRAM, already
being adopted
by Samsung and
SK hynix for
DRAM in PC
and datacenter
(i.e., the largest
markets
segments).
Breakdown by end-market NEW
17
17
17
Memory Packaging | Sample | www.yole.fr | ©2021
2020-2026 NAND PACKAGING MARKET FORECAST
In US$ and units (# of packages and # of 12’’ wafers)
0
500
1 000
1 500
2 000
2 500
3 000
3 500
4 000
4 500
5 000
2020 2021 2022 2023 2024 2025 2026
Number
of
Packages
(in
Mu)
PC Datacenter Mobile Consumer Auto Other
$-
$1 000
$2 000
$3 000
$4 000
$5 000
$6 000
2020 2021 2022 2023 2024 2025 2026
Revenue
(in
$M)
Hybrid Bonding - YMTC 3D NAND packages
WLCSP
Wirebond - Multi Chip Package
Wirebond - Discrete
Leadframe
Breakdown by end-market NEW
NAND Package Market Revenues byType of Package (in $M) NAND Package MarketVolume by Application (in Mu)
18
18
18
$-
$200
$400
$600
$800
$1 000
2020 2021 2022 2023 2024 2025 2026
Revenue
(in
$M)
Other (incl. EEPROM, EPROM, ROM,
etc.)
RRAM - incl. CBRAM and OxRAM
MRAM - incl. STT and Toggle
PCM - incl. 3D XPoint
Flip chip is the leading type of package for DRAM, already being adopted by Samsung and SK hynix for DRAM in PC and
datacenter (i.e., the largest markets segments).
Memory Packaging | Sample | www.yole.fr | ©2021
2020-2026 OTHER MEMORY PACKAGING MARKET FORECAST
In US$ and units (# of packages and # of 12’’ wafers)
0
0,5
1
1,5
2
2,5
2020 2021 2022 2023 2024 2025 2026
Number
of
Wafers
(in
Mu)
Leadframe Wirebond WLCSP
Breakdown by memory technology NEW
Other Memory MarketVolume inWafers byType of Package
(in Mu)
Other Memory Package Market Revenues by Memory
Technology (in $M)
19
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Memory Packaging | Sample | www.yole.fr | ©2021
MEMORY PACKAGING IN CHINA
20
20
Notes: Yole estimates that by 2026 YMTC could achieve ~X% of the overall NAND industry wafer production, while CXMT
could achieve ~X% of the DRAM industry production.
Memory Packaging | Sample | www.yole.fr | ©2021
ESTIMATE OFTHE MEMORY PACKAGING OPPORTUNITY IN CHINA
YMTC and CXMT will be generating a >$1B opportunity for OSATS by 2026
NAND Packaging for YMTC (w/o hybrid bonding) DRAM Packaging for CXMT
Wafer Production
(in millions of 12'' wafers per year)
Estimate of the Revenue Opportunity for
OSATs (in $M)
Breakdown by player/technology (%)
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21
MEMORY PACKAGING ECOSYSTEM
Memory Packaging | Sample | www.yole.fr | ©2021
22
22
GPU/CPU Suppliers
Memory Packaging | Sample | www.yole.fr | ©2021
MANUFACTURING OF (x)PUs WITH HBM – SUPPLY CHAIN
Stacking of the memory dies
DRAM Stack Manufacturing
Including TSV formation, wafer bumping and
stacking of the DRAM dies and the logic die
Assembly of HBM stack and CPU/GPU on interposer and final packaging
Focus of this report
The ASP of HBM includes the
DRAM/logic wafer middle-end
manufacturing (TVS and microbumping)
23
23
23
ADVANCED PACKAGING FOR MEMORY-LOGIC INTEGRATION
Process approach Description Example Applications
Interposer
approach
• Interposer used to interconnect
with the dies on top.
• Bottom of the interposer is
connected to the substrate.
• µbumps for interconnections.
CoWoS
(Chip on Wafer on
Substrate) by TSMC
Datacenter,
client/PC,
automotive
Embedded Bridge
Approach
• Connection of CPU with HBM
with a silicon bridge.
• Same connection between the
different devices.
• µbumps for interconnections with
the substrate.
EMIB
(Embedded Multi Die
Interconnect Bridge) by Intel;
Co-EMIB
Datacenter,
gaming
Heterogeneous
Integrated Fan Out
• Fan-out package flip-chip mounted
on a high pin count ball grid array
(BGA) substrate.
• Die-to-die (D2D) interconnections
between multiple chips.
FOCoS
(Fan Out Chip on Substrate)
by ASE
InFO by TSMC
Computing,
mobile,
datacenter
3D Integration
(emerging)
• Direct chip to chip interconnection
without interposer.
• Devices are stacked together.
SoIC
(System on Integrated Chip)
by TSMC; Foveros
by Intel.
High performance
computing,
gaming
Memory Packaging | Sample | www.yole.fr | ©2021
24
24
ADVANCED PACKAGING FOR MEMORY-LOGIC INTEGRATION
Memory Packaging | Sample | www.yole.fr | ©2021
25
Contact our
SalesTeam
for more
information
25
Contact our
SalesTeam
for more
information
Equipment and Materials for
3D-NAND Manufacturing 2020
Emerging Non-Volatile
Memory 2021
DRAM & NAND Quarterly
Market Monitors
Status of the Memory
Industry 2021
Memory Packaging | Sample | www.yole.fr | ©2021
YOLE GROUP OF COMPANIES RELATED PRODUCTS – MEMORY
Yole Développement
Status of the Advanced
Packaging Industry 2021
Advanced Packaging
Quarterly Market Monitor
26
Contact our
SalesTeam
for more
information
26
Contact our
SalesTeam
for more
information
Micron LPDDR5 12GB
Mobile Memory
Samsung LPDDR5 12GB
Mobile Memory
YTMC 3D NAND Flash Memory
Memory Packaging | Sample | www.yole.fr | ©2021
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
NVIDIA A100 Ampere GPU
27
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?
About Yole Développement | www.yole.fr | ©2021
© 2021
From Technologies to Markets
Yole
Développement
Who are we?
29
©2019 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERING THE SEMICONDUCTOR INDUSTRY
Semiconductor, Memory &
Computing
o Semiconductor Packaging and Substrates
o Semiconductor Manufacturing
o Memory
o Computing and Software
Power & Wireless
o RF Devices & Technologies
o Compound Semiconductors & Emerging
Materials
o Power Electronics
o Batteries & Energy Management
Photonics & Sensing
o Photonics
o Lighting
o Imaging
o Sensing & Actuating
o Display
About Yole Développement | www.yole.fr | ©2021
30
A COMPLETE SET OF PRODUCTS & SERVICES TO ANSWERYOUR NEEDS
WEEKLY
TRACKS
Insight
› Teardowns of phones, smart
home, wearables and automotive
modules and systems
› Bill-of-Materials
› Block diagrams
Format
› Web access
› PDF and Excel files
› High-resolution photos
Topics
› Consumer: Smartphones, smart
home, wearables
› Automotive: Infotainment,ADAS,
Telematics
175+ teardowns per year
125+ reports per year
YEARLY
REPORTS
Insight
› Yearly reports
› Market, technology and strategy
analysis
› Supply chain changes analysis
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
115+ reports per year
SERVICES
QUARTERLY
MONITORS
Insight
› Quarterly updated market data and
technology trends in units, value
and wafer
› Direct access to the analyst
Format
› Excel files with data
› PDF files with analyses graphs and
key facts
› Web access (to be available soon)
Topics
› Advanced Packaging
› Application Processor
› DRAM
› NAND
› Compound Semiconductor
› CMOS Image Sensors
› Smartphones
7 different monitors
quarterly updated
CUSTOM
SERVICE
Insight
› Specific and dedicated projects
› Strategic, financial, technical, supply
chain, market and other
semiconductor-related fields
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
190 custom projects
per year
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31
PART OFYOLE GROUP OF COMPANIES
About Yole Développement | www.yole.fr | ©2021
M&A
and evaluation of companies
Direct acces to the analysts
Market, technology, and
strategy consulting
Teardown and reverse
engineering
Cost simulation tools
Structure, process and cost
analysis
32
About Yole Développement | www.yole.fr | ©2020
A WORLDWIDE PRESENCE
100+ collaborators in 8 different countries
Headquarters
› Lyon – Yole Développement
› Nantes – System Plus Consulting
Singapore
Tokyo
Shenzhen
Hsinchu
Lyon
Frankfurt
Nantes Boise
Cornelius
Raleigh
Phoenix
Austin
Seoul
33
A WIDE RANGE OF INFORMATION SOURCES
Our unique
position
allows us to
obtain
detailed and
accurate
information to
meet your
needs
About Yole Développement | www.yole.fr | ©2021
5,000 players
interviews
per year
120+ annual
conferences
6,800+ companies’
news relayed
70+ analysts
worldwide
800+ systems and
modules
teardowns
available –
175+ in 2020
20+ years in the
semiconductor
industry
34
A UNIQUE AND PROVEN METHODOLOGY
› Market segmentation
› Per application
› Per technical needs
› Per technology
adoption and behavior
of the supply chain
MARKET › Top to bottom
› Industry organizations
› Aggregate of market forecasts at
system and device levels up to the
wafer and equipment
› Bottom-up
› Ecosystem analysis
› Aggregate of all players’ revenue at
device, module and system levels
› In unit, dollar and wafer
BOTTOM-UP
&TOP-TO-BOTTOM
› Technology analysis
› Competitive landscape
› Technology comparison
› Reverse costing
› Reverse engineering
› Technology life cycle
› Development cycles
› Adoption by the supply chain
› HV manufacturing and evolutions
TECHNOLOGY
Thanks to its marketing approach, its
understanding of the industrial and
technical environment and information
collection, Yole Développement can assist
companies at every stage of their growth.
About Yole Développement | www.yole.fr | ©2021
35
OUR NETWORK IS THE ENTIRE SUPPLY CHAIN ACROSS 6 MARKETS
Integrators,
end-users and
software developers
Device
manufacturers
Suppliers: material,
equipment, OSAT, foundries…
Financial investors, R&D centers
Mobile
& Consumer
Automotive
& Mobility
Telecom &
Infrastructure Medical Industrial
Defense
& Aerospace
6
key markets
About Yole Développement | www.yole.fr | ©2021
36
About Yole Développement | www.yole.fr | ©2020
CONTACTS
Western US & Canada
Hal Levy - hal.levy@yole.fr
+ 1 408 334-0554
Eastern US & Canada
ChrisYouman - chris.youman@yole.fr
+1 919 607 9839
Europe and RoW
Lizzie Levenez - lizzie.levenez@yole.f
+49 151 23 54 41 82
DACH (North Germany,Austria, Switzerland)
Neha CHAUDHURY - neha.chaudhury@yole.fr
+49 172 97 47 248
Benelux, UK & Scandinavia
Marine Wybranietz - marine.wybranietz@yole.fr
+49 69 96 21 76 78
South Germany & France
Martine Komono - martine.komono@yole.fr
+49 173 69 43 31
India and RoA
Takashi Onozawa - takashi.onozawa@yole.fr
+81 80 4371 4887
Greater China
MavisWang - mavis.wang@yole.fr
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - peter.ok@yole.fr
+82 10 4089 0233
Japan
Miho Ohtake - miho.ohtake@yole.fr
+81 34 4059 204
Toru Hosaka – toru.hosaka@yole.fr
+81 90 1775 3866
Japan and Singapore
Itsuyo Oshiba - itsuyo.oshiba@yole.fr
+81 80 3577 3042
FINANCIAL SERVICES
› Jean-Christophe Eloy - eloy@yole.fr
+33 4 72 83 01 80
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+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
jerome.azemar@yole.fr - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
jcoulon@systemplus.fr - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy, Public Relations
sandrine.leroy@yole.fr - +33 4 72 83 01 89
› General inquiries: info@yole.fr - +33 4 72 83 01 80
REPORTS, MONITORS &TRACKS
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Memory Packaging 2021 - Sample

  • 1. From Technologies to Markets © 2021 From Technologies to Markets Memory Packaging Market and Technology Report 2021 Sample
  • 2. 2 2 o Mobile 158 o Personal Computer (Client) 168 o Consumer 175 o Automotive 183 • Memory Packaging Forecast 193 o NAND Packaging Market Forecast – in $M, units, and wafers 204 o DRAM Packaging Market Forecast – in $M, units, and wafers 212 o Other Stand-Alone Memory Packaging Forecast 220 • Ecosystem 230 o Supply Chain Mapping 231 o Supply Chain Challenges – Focus on Shortages 240 o M&A and Partnerships 249 • China’s Memory Business 254 • Advanced Packaging for Memory-Logic Integration 276 • Hybrid Bonding - Overview 295 • Packaging Materials - Overview 311 • General Conclusions 321 • Noteworthy News 325 • How to use our data? 331 • Yole Presentation 332 • Glossary and Definitions 2 • Table of Contents 10 • Report Objectives 11 • Scope of the Report 12 • Methodology & Definitions 13 • About the Authors 14 • Companies Cited in this Report 15 • Comparison with the 2017 Report 16 • Who Should Be Interested in This Report 17 • Yole Group Related Reports 18 • Three-Slide Summary 20 • Executive Summary 24 • Context – Overview of the Memory Business 65 o Stand-Alone Memory Technology and Market 72 o Stand-Alone Memory Market Players 83 • Overview of Memory Packaging 96 o Memory Packaging Technology 107 o Memory Packaging Players 133 • Memory Packaging Trends by End Markets 148 o Datacenter 151 Memory Packaging | Sample | www.yole.fr | ©2021 TABLE OF CONTENTS
  • 3. 3 3 3 Memory Packaging | Sample | www.yole.fr | ©2021 COMPANIES CITED IN THIS REPORT Amkor,Applied Materials,Ardentec,ASE,ASML,Avalanche, Canon, Carsem, Centon, ChipbondTechnology, ChipMOS Technologies, CXMT, Dialog Semiconductor, Dosilicon, ESMT, Etron, Everspin, Formosa Advanced Technologies, Fujitsu, GigaDevice, GlobalFoundries, Greatek Elec, Hana Micron, H-Grace, Hitachi, HLMC, IBM, IDT, Inari Berhad, Infineon-Cypress, Intel, ISSI, Jiangsu Silicon Integrity SemiconductorTechnology, JCET Group, JHICC, KingYuan Electronics, Kingston, Kioxia, KLA Tencor, Lam Research, Lapis, LB Semicon, Lingsen Precision Industries, Liteon, Longsys, Macronix, Marvell, Maxim, Maxio, MediaTek, Microchi, Micron, Montage, Nanya, NEC, Nepes Corporation, NetApp, NetList, Nuvoton-Panasonic, Orient Semiconductor Electronics, Phison, Powerchip, PowertechTechnology, Rambus, Realtek, Renesas, Samsung, Seagate, SFA Semicon, Signetics, Sigurd Microelectronics, Silicon Motion, SJ Semi, SK Hynix, Smart Modular, SMIC, Sony, Spin memory, STMicroelectronics, Swissbit,TEL,Texas Instruments,Tianshui Huatian Microelectronics,Tong Hsing,Tongfu Microelectronics, Transcend,TSMC, UMC, Unisem Berhad, UTAC,Viking,Violin Memory,Walton Advanced Engineering,Weebit, Winbond,WLCSP, XMC,YMTC, and more.
  • 4. 4 4 Simone Bertolazzi,Ph.D. Simone is a Senior Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of Yole’s memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics. Simone earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude. Email: simone.bertolazzi@yole.fr Thomas Illner As a Technology and Market Analyst Intern, Thomas Illner is member of the Semiconductor, Memory & Computing at Yole Développement (Yole), part of Yole Group of Companies. Thomas performs, in collaboration with his team, a strategic and technical analysis of the memory packaging and materials related to the packaging. Prior to Yole, Thomas worked as an intern at Sartorius Stedim Biotech on the irradiation of biomedical films materials. Thomas holds a Physics and Chemical engineer degree with a specialization in polymers sciences at the European School of Chemistry of Strasbourg, France. He is preparing an MBA as complementary degree at the EM Strasbourg. Email: thomas.illner@yole.fr Memory Packaging | Sample | www.yole.fr | ©2021 Biographies & contacts ABOUT THE AUTHORS
  • 5. 5 5 5 Memory Packaging | Sample | www.yole.fr | ©2021 METHODOLOGIES & DEFINITIONS Market Volume (in Munits) ASP (in $) Revenue (in $M) Yole’s market forecast model is based on the matching of several sources: Information Aggregation Preexisting information
  • 6. 6 6 Memory Packaging | Sample | www.yole.fr | ©2021 SCOPE OFTHE REPORT – MARKET ANALYSISWITH BREAKDOWN BY: MemoryTechnologies PackagingTechnologies End Markets DRAM NAND NOR and other technologies (EEPROM, EPROM, ROM, etc.) PCM, ReRAM, MRAM Leadframe Wirebond (organic substrate) Flip Chip CPU 3DTSV DRAM TSV HBM Hybrid Bonding (XtackingTM) WLCSP Consumer Mobile Datacenter Automotive PC/Client Your needs are out of scope of this report? Contact us for a custom study: Notes: (1) Multiple package on board / PCB in module format (e.g. DIMM ) is not included in the market forecast. (2) Packaging revenues (substrate, assembly, stacking, TSV formation, bumping, etc.) are included in the market forecast but not testing.
  • 7. 7 7 Memory Packaging | Sample | www.yole.fr | ©2021 REPORT OBJECTIVES Yole has combined its multi-decade expertise in semiconductor packaging and memory technologies/markets to deliver the new edition of the “Memory Packaging” report, which has the following main objectives: • Present an overview of the semiconductor memory market: • Market trends for DRAM, NAND, NOR, (NV)SRAM, emerging NVM and other stand-alone memory technologies. • Provide an understanding of memory packaging technologies and markets: • Technical characteristics, manufacturing methods, advantages/limitations, development status for a variety of packaging approaches, among which leadframe, wirebond,WLCSP, flip chip,TSV-based stacking (HBM and 3DS) and hybrid bonding (YMTC’s 3D NAND). • Packaging trends for 5 different end-markets: datacenter, PC, mobile, consumer and automotive. • Packaging trends for DRAM, NAND and other stand-alone technologies,including NOR Flash, MRAM, PCM, ReRAM, and more. • Offer market forecasts for the memory packaging : • 2020-2026 market forecast: revenue (US$), volume (number of packages) and wafer shipments with breakdown by type of package, type of memory technology, as well as end-market. • Evolution of ASP and number of dies-per-package by type of package, type of memory technology and end-market. • Describe the memory packaging business: • Market drivers, challenges, opportunities and technology requirements for 5 end-markets, roadmaps and players. • Analysis of the memory packaging supply chain and players’ dynamics with focus on OSATs and memory IDMs. • Detail and analyze the competitive landscape: • Recent acquisitions and funding, latest company news, key players by technology and application.
  • 8. 8 COMPARISON WITHTHE PREVIOUS EDITION OFTHE REPORT (2017) What we saw, what we missed What we saw: o Market: • The total stand-alone memory wafer production was correctly predicted to rise to ~35M wafers (12’’) in 2020. o Players • The rising Chinese memory IDMs are indeed fueling a strong business opportunity for OSATs in China. YMTC (Wuhan, NAND) and CXMT (Hefei, DRAM) do not have fully-developed assembly/testing divisions, so they need to outsource all their memory packaging to OSATs.This is a strong tailwind for JCET, HT-Tech andTongFu. o Technologies • The growing penetration of flip-chip packages for PC and server DRAM was captured correctly. As anticipated, TSV-based stacking of NAND devices – introduced byToshiba (Kioxia) in 2017 – had a negligible market penetration. What we missed: o Market • In the last 4 years, the memory market went through a rapid growth and subsequent decline. After hitting record high revenues in 2017 and 2018, the memory industry entered an oversupply condition. 2019 was a year of deep decline (revenues down 34%). • Note: the overall memory packaging market reported in 2017 included the ASP contribution of testing. In the current edition, we disentangled the different contributions to provide only the packaging-related revenues. o Technologies • In 2017, we underestimated the evolution of the average number of dies per package for NAND and DRAM, and consequently we overestimated the package volume. We revised such data through the analysis of a large number of devices and systems in collaboration with our reverse-engineering partner System Plus Consulting. Memory Packaging | Sample | www.yole.fr | ©2021
  • 9. 9 9 OVERVIEW OFTHE MEMORY BUSINESS Memory Packaging | Sample | www.yole.fr | ©2021
  • 10. 10 10 10 Memory Packaging | Sample | www.yole.fr | ©2021 MEMORY PACKAGING PLATFORMS Different types of package integration Semiconductor Package Single Die Package Multi Die Package Homogeneous Stacking Heterogenous Stacking PoP format MCP Multiple package on board / PCB in module format (e.g., DIMM ) Not included in the forecast (e.g. DRAM die stack or NAND die stack) (e.g., DRAM and AP in smartphones) (e.g., UFS or eMMC controller + NAND dies +DRAM dies)
  • 11. 11 11 MEMORY PACKAGING TECHNOLOGIES Memory Packaging | Sample | www.yole.fr | ©2021
  • 12. 12 12 12 MEMORY PACKAGING TECHNOLOGY – FOCUS ON MOBILE Key goals: thinness, minimum footprint-on-board, low cost and high bit density APU Substrate NAND-based MCP NAND LPDDR 3D NAND eMMC controller APU Substrate eMMC PoP LPDDR 3D NAND eMMC controller Substrate eMCP LPDDR APU 3D NAND eMMC controller Substrate ePoP LPDDR APU 3D NAND UFS controller APU Substrate UFS PoP LPDDR 3D NAND UFS controller Substrate uMCP LPDDR APU Memory Packaging | Sample | www.yole.fr | ©2021
  • 13. 13 13 MEMORY PACKAGING PLAYERS Memory Packaging | Sample | www.yole.fr | ©2021
  • 14. 14 MEMORY PACKAGING PLAYERS – IDMs AND OSATs IDMs vs OSATs memory packaging revenue IDMs are doing most of their memory packaging in house.We estimate that less than ¼ of the memory packaging market are currently generated by OSATS. Memory Packaging | Sample | www.yole.fr | ©2021 IDMs OSATs - packaging for non-Chinese IDMs OSATs - packaging for Chinese IDMs 2020 $13.1B 2026 $19.8B 68% 31% 1% 65% 29% 6% CAGR20-26 ≈ 7%
  • 15. 15 15 15 • Two opposite trends are influencing the memory-packaging business carried out by OSATs: • Chinese players –YMTC and CXMT – are ramping up their memory capacity boosting memory-capacity demand to OSATs. • Following Samsung and SK hynix, Micron has started the conversion of DRAM packaging from wirebond to flip chip increasing its internal back-end capacity.This implies less outsourcing to OSATs. Memory Packaging | Sample | www.yole.fr | ©2021 MEMORY PACKAGING REVENUE – IDMsVERSUS OSATs Estimated evolution of revenues by OSATs and IDMs OSAT $ ↑ OSAT $ ↓ Memory Packaging Market in $M Memory Packaging Market - IDM vs OSAT Breakdown
  • 16. 16 2020-2026 DRAM PACKAGING MARKET FORECAST In US$ and units (# of packages and # of 12’’ wafers) Memory Packaging | Sample | www.yole.fr | ©2021 PC Datacenter Mobile Consumer Auto Other CAGR20-26 ≈ X% $XX $XX $XX 2020 2026 $XXB Leadframe Wirebond – Discrete Wirebond – MCP Flip Chip WLCSP TSV – 3DS TSV - HBM Flip chip is the leading type of package for DRAM, already being adopted by Samsung and SK hynix for DRAM in PC and datacenter (i.e., the largest markets segments). Breakdown by end-market NEW
  • 17. 17 17 17 Memory Packaging | Sample | www.yole.fr | ©2021 2020-2026 NAND PACKAGING MARKET FORECAST In US$ and units (# of packages and # of 12’’ wafers) 0 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 2020 2021 2022 2023 2024 2025 2026 Number of Packages (in Mu) PC Datacenter Mobile Consumer Auto Other $- $1 000 $2 000 $3 000 $4 000 $5 000 $6 000 2020 2021 2022 2023 2024 2025 2026 Revenue (in $M) Hybrid Bonding - YMTC 3D NAND packages WLCSP Wirebond - Multi Chip Package Wirebond - Discrete Leadframe Breakdown by end-market NEW NAND Package Market Revenues byType of Package (in $M) NAND Package MarketVolume by Application (in Mu)
  • 18. 18 18 18 $- $200 $400 $600 $800 $1 000 2020 2021 2022 2023 2024 2025 2026 Revenue (in $M) Other (incl. EEPROM, EPROM, ROM, etc.) RRAM - incl. CBRAM and OxRAM MRAM - incl. STT and Toggle PCM - incl. 3D XPoint Flip chip is the leading type of package for DRAM, already being adopted by Samsung and SK hynix for DRAM in PC and datacenter (i.e., the largest markets segments). Memory Packaging | Sample | www.yole.fr | ©2021 2020-2026 OTHER MEMORY PACKAGING MARKET FORECAST In US$ and units (# of packages and # of 12’’ wafers) 0 0,5 1 1,5 2 2,5 2020 2021 2022 2023 2024 2025 2026 Number of Wafers (in Mu) Leadframe Wirebond WLCSP Breakdown by memory technology NEW Other Memory MarketVolume inWafers byType of Package (in Mu) Other Memory Package Market Revenues by Memory Technology (in $M)
  • 19. 19 19 Memory Packaging | Sample | www.yole.fr | ©2021 MEMORY PACKAGING IN CHINA
  • 20. 20 20 Notes: Yole estimates that by 2026 YMTC could achieve ~X% of the overall NAND industry wafer production, while CXMT could achieve ~X% of the DRAM industry production. Memory Packaging | Sample | www.yole.fr | ©2021 ESTIMATE OFTHE MEMORY PACKAGING OPPORTUNITY IN CHINA YMTC and CXMT will be generating a >$1B opportunity for OSATS by 2026 NAND Packaging for YMTC (w/o hybrid bonding) DRAM Packaging for CXMT Wafer Production (in millions of 12'' wafers per year) Estimate of the Revenue Opportunity for OSATs (in $M) Breakdown by player/technology (%)
  • 21. 21 21 MEMORY PACKAGING ECOSYSTEM Memory Packaging | Sample | www.yole.fr | ©2021
  • 22. 22 22 GPU/CPU Suppliers Memory Packaging | Sample | www.yole.fr | ©2021 MANUFACTURING OF (x)PUs WITH HBM – SUPPLY CHAIN Stacking of the memory dies DRAM Stack Manufacturing Including TSV formation, wafer bumping and stacking of the DRAM dies and the logic die Assembly of HBM stack and CPU/GPU on interposer and final packaging Focus of this report The ASP of HBM includes the DRAM/logic wafer middle-end manufacturing (TVS and microbumping)
  • 23. 23 23 23 ADVANCED PACKAGING FOR MEMORY-LOGIC INTEGRATION Process approach Description Example Applications Interposer approach • Interposer used to interconnect with the dies on top. • Bottom of the interposer is connected to the substrate. • µbumps for interconnections. CoWoS (Chip on Wafer on Substrate) by TSMC Datacenter, client/PC, automotive Embedded Bridge Approach • Connection of CPU with HBM with a silicon bridge. • Same connection between the different devices. • µbumps for interconnections with the substrate. EMIB (Embedded Multi Die Interconnect Bridge) by Intel; Co-EMIB Datacenter, gaming Heterogeneous Integrated Fan Out • Fan-out package flip-chip mounted on a high pin count ball grid array (BGA) substrate. • Die-to-die (D2D) interconnections between multiple chips. FOCoS (Fan Out Chip on Substrate) by ASE InFO by TSMC Computing, mobile, datacenter 3D Integration (emerging) • Direct chip to chip interconnection without interposer. • Devices are stacked together. SoIC (System on Integrated Chip) by TSMC; Foveros by Intel. High performance computing, gaming Memory Packaging | Sample | www.yole.fr | ©2021
  • 24. 24 24 ADVANCED PACKAGING FOR MEMORY-LOGIC INTEGRATION Memory Packaging | Sample | www.yole.fr | ©2021
  • 25. 25 Contact our SalesTeam for more information 25 Contact our SalesTeam for more information Equipment and Materials for 3D-NAND Manufacturing 2020 Emerging Non-Volatile Memory 2021 DRAM & NAND Quarterly Market Monitors Status of the Memory Industry 2021 Memory Packaging | Sample | www.yole.fr | ©2021 YOLE GROUP OF COMPANIES RELATED PRODUCTS – MEMORY Yole Développement Status of the Advanced Packaging Industry 2021 Advanced Packaging Quarterly Market Monitor
  • 26. 26 Contact our SalesTeam for more information 26 Contact our SalesTeam for more information Micron LPDDR5 12GB Mobile Memory Samsung LPDDR5 12GB Mobile Memory YTMC 3D NAND Flash Memory Memory Packaging | Sample | www.yole.fr | ©2021 YOLE GROUP OF COMPANIES RELATED REPORTS System Plus Consulting NVIDIA A100 Ampere GPU
  • 27. 27 Yole Group of Companies, including Yole Développement, System Plus Consulting and PISEO, are pleased to provide you a glimpse of our accumulated knowledge. We invite you to share our data with your own network, within your presentations, press releases, dedicated articles and more, but you first need approval from Yole Public Relations department. If you are interested, feel free to contact us right now! We will also be more than happy to give you updated data and appropriate formats. Your contact: Sandrine Leroy, Dir. Public Relations Email: leroy@yole.fr HOWTO USE OUR DATA? About Yole Développement | www.yole.fr | ©2021
  • 28. © 2021 From Technologies to Markets Yole Développement Who are we?
  • 29. 29 ©2019 | www.yole.fr | About Yole Développement FIELDS OF EXPERTISE COVERING THE SEMICONDUCTOR INDUSTRY Semiconductor, Memory & Computing o Semiconductor Packaging and Substrates o Semiconductor Manufacturing o Memory o Computing and Software Power & Wireless o RF Devices & Technologies o Compound Semiconductors & Emerging Materials o Power Electronics o Batteries & Energy Management Photonics & Sensing o Photonics o Lighting o Imaging o Sensing & Actuating o Display About Yole Développement | www.yole.fr | ©2021
  • 30. 30 A COMPLETE SET OF PRODUCTS & SERVICES TO ANSWERYOUR NEEDS WEEKLY TRACKS Insight › Teardowns of phones, smart home, wearables and automotive modules and systems › Bill-of-Materials › Block diagrams Format › Web access › PDF and Excel files › High-resolution photos Topics › Consumer: Smartphones, smart home, wearables › Automotive: Infotainment,ADAS, Telematics 175+ teardowns per year 125+ reports per year YEARLY REPORTS Insight › Yearly reports › Market, technology and strategy analysis › Supply chain changes analysis › Reverse costing and reverse engineering Format › PDF files with analyses › Excel files with graphics and data Topics › Photonics, Imaging & Sensing › Lighting & Displays › Power Electronics & Battery › Compound Semiconductors › Semiconductor Manufacturing and Packaging › Computing & Memory 115+ reports per year SERVICES QUARTERLY MONITORS Insight › Quarterly updated market data and technology trends in units, value and wafer › Direct access to the analyst Format › Excel files with data › PDF files with analyses graphs and key facts › Web access (to be available soon) Topics › Advanced Packaging › Application Processor › DRAM › NAND › Compound Semiconductor › CMOS Image Sensors › Smartphones 7 different monitors quarterly updated CUSTOM SERVICE Insight › Specific and dedicated projects › Strategic, financial, technical, supply chain, market and other semiconductor-related fields › Reverse costing and reverse engineering Format › PDF files with analyses › Excel files with graphics and data Topics › Photonics, Imaging & Sensing › Lighting & Displays › Power Electronics & Battery › Compound Semiconductors › Semiconductor Manufacturing and Packaging › Computing & Memory 190 custom projects per year About Yole Développement | www.yole.fr | ©2021
  • 31. 31 PART OFYOLE GROUP OF COMPANIES About Yole Développement | www.yole.fr | ©2021 M&A and evaluation of companies Direct acces to the analysts Market, technology, and strategy consulting Teardown and reverse engineering Cost simulation tools Structure, process and cost analysis
  • 32. 32 About Yole Développement | www.yole.fr | ©2020 A WORLDWIDE PRESENCE 100+ collaborators in 8 different countries Headquarters › Lyon – Yole Développement › Nantes – System Plus Consulting Singapore Tokyo Shenzhen Hsinchu Lyon Frankfurt Nantes Boise Cornelius Raleigh Phoenix Austin Seoul
  • 33. 33 A WIDE RANGE OF INFORMATION SOURCES Our unique position allows us to obtain detailed and accurate information to meet your needs About Yole Développement | www.yole.fr | ©2021 5,000 players interviews per year 120+ annual conferences 6,800+ companies’ news relayed 70+ analysts worldwide 800+ systems and modules teardowns available – 175+ in 2020 20+ years in the semiconductor industry
  • 34. 34 A UNIQUE AND PROVEN METHODOLOGY › Market segmentation › Per application › Per technical needs › Per technology adoption and behavior of the supply chain MARKET › Top to bottom › Industry organizations › Aggregate of market forecasts at system and device levels up to the wafer and equipment › Bottom-up › Ecosystem analysis › Aggregate of all players’ revenue at device, module and system levels › In unit, dollar and wafer BOTTOM-UP &TOP-TO-BOTTOM › Technology analysis › Competitive landscape › Technology comparison › Reverse costing › Reverse engineering › Technology life cycle › Development cycles › Adoption by the supply chain › HV manufacturing and evolutions TECHNOLOGY Thanks to its marketing approach, its understanding of the industrial and technical environment and information collection, Yole Développement can assist companies at every stage of their growth. About Yole Développement | www.yole.fr | ©2021
  • 35. 35 OUR NETWORK IS THE ENTIRE SUPPLY CHAIN ACROSS 6 MARKETS Integrators, end-users and software developers Device manufacturers Suppliers: material, equipment, OSAT, foundries… Financial investors, R&D centers Mobile & Consumer Automotive & Mobility Telecom & Infrastructure Medical Industrial Defense & Aerospace 6 key markets About Yole Développement | www.yole.fr | ©2021
  • 36. 36 About Yole Développement | www.yole.fr | ©2020 CONTACTS Western US & Canada Hal Levy - hal.levy@yole.fr + 1 408 334-0554 Eastern US & Canada ChrisYouman - chris.youman@yole.fr +1 919 607 9839 Europe and RoW Lizzie Levenez - lizzie.levenez@yole.f +49 151 23 54 41 82 DACH (North Germany,Austria, Switzerland) Neha CHAUDHURY - neha.chaudhury@yole.fr +49 172 97 47 248 Benelux, UK & Scandinavia Marine Wybranietz - marine.wybranietz@yole.fr +49 69 96 21 76 78 South Germany & France Martine Komono - martine.komono@yole.fr +49 173 69 43 31 India and RoA Takashi Onozawa - takashi.onozawa@yole.fr +81 80 4371 4887 Greater China MavisWang - mavis.wang@yole.fr +886 979 336 809 +86 136 6156 6824 Korea Peter Ok - peter.ok@yole.fr +82 10 4089 0233 Japan Miho Ohtake - miho.ohtake@yole.fr +81 34 4059 204 Toru Hosaka – toru.hosaka@yole.fr +81 90 1775 3866 Japan and Singapore Itsuyo Oshiba - itsuyo.oshiba@yole.fr +81 80 3577 3042 FINANCIAL SERVICES › Jean-Christophe Eloy - eloy@yole.fr +33 4 72 83 01 80 › Ivan Donaldson - ivan.donaldson@yole.fr +1 208 850 3914 CUSTOM PROJECT SERVICES › Jérome Azémar, Yole Développement - jerome.azemar@yole.fr - +33 6 27 68 69 33 › Julie Coulon, System Plus Consulting - jcoulon@systemplus.fr - +33 2 72 17 89 85 GENERAL › Sandrine Leroy, Public Relations sandrine.leroy@yole.fr - +33 4 72 83 01 89 › General inquiries: info@yole.fr - +33 4 72 83 01 80 REPORTS, MONITORS &TRACKS Follow us on About Yole Développement | www.yole.fr | ©2021