Advanced Packaging Quarterly Market Monitor Q3 2021 - Sample

© 2021
From Technologies to Markets
Advanced Packaging
Quarterly Market
Monitor
Packaging Service 2021
Q3 2021
Sample

2
ABOUTTHE AUTHORS
Biographies & contacts
Santosh KUMAR
Santosh Kumar is currently working as Principal Analyst and Director - Packaging, Assembly & Substrates for Yole Développement's activities in Korea.
Based in Seoul, Santosh is strongly involved in the market, technology, and strategic analysis of the microelectronic assembly & packaging technologies
and presents his vision of the industry in numerous conferences as well as through papers and patents publication.
Santosh Kumar received his bachelor’s and master’s degrees in engineering from the Indian Institute of Technology (IIT), Roorkee, and The University
of Seoul, respectively.
Email: santosh.kumar@yole.fr
Stefan CHITORAGA
Favier Shoo is a Team Lead Analyst in the Packaging team within the Semiconductor,Memory and Computing Division atYole Développement.Based in
Singapore, Favier manages an international team and develops the team’s technical and market expertise. In Addition, Favier generates technology &
market reports, provides strategic consulting, and performs custom studies. He is regularly engaged in conferences,presentations, keynotes, and panel
sessions and has developed a deep understanding of the supply chain and core business values.
Favier holds a bachelor’s in Materials Engineering (Hons) and a Minor in Entrepreneurship from NanyangTechnological University (NTU) Singapore.
Email: favier.shoo@yole.fr
Favier SHOO
Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Développement (Yole).As part of the
Semiconductor,Memory & Computing division atYole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is
involved daily in the production of technology & market reports and custom consulting projects.
Stefan holds a Bachelor’s in Electronics and Computer Science for IndustryApplications from the Polytech Grenoble (France).
Email: stefan.chitoraga@yole.fr
Advanced Packaging Quarterly Market Monitor | Q3 2021 | Sample | www.yole.fr | © 2021

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3
ADVANCED PACKAGING MONITOR – MODULES OVERVIEW
ADVANCED PACKAGING MONITOR
Fan-out Packaging
(Wafer & Panel Level)
1 MODULE I
WLCSP / Fan-In Packaging
2 MODULE II
2.5D/3D Stacked Packaging
3 MODULE III
FCBGA Packaging
4 MODULE IV
FCCSP Packaging
5 MODULEV
System-in-Package (SiP)
6 MODULEVI

Advanced Packaging Quarterly Market Monitor | Q3 2021 | Sample | www.yole.fr | © 2021 4
ADVANCED PACKAGING MONITOR SCOPE
The main objectives of this monitor are the following:
• Near-term market dynamics on a quarterly basis
• Long-term market dynamics for 2020-2026
• CapEx & capacity per major player
• Market shares of leading OSATs/Foundries
• Package ASP per given market/platform
• Device/application adoption for advanced packaging technologies
The Fan-Out,WLCSP / Fan-In, 3D Stacked, FCBGA, FCCSP and SiP markets are studied from the following
angles:
• Supply and demand
• End-user applications and key growth drivers/areas
• Process technologies
• Device application mix
• Production, CapEx,revenue and packageASP
• 3D stacked package includes Logic & DRAM wafers: 3D Stacked package includes HBM, 3DS DRAM, 3D NAND, 3D
SoC/SoIC,3D stacked CMOS Image Sensors
• Revenue & ASPs reflect packaging only. Final Test is NOT included.
• **WLCSP components used in RF-SiP packages are NOT included in theWLCSP category – This will be provided in a
future update to the monitor
• SiP Package-level market is being sized, SiP wafer-level market is not included.

5
5
ADVANCED PACKAGING MONITOR METHODOLOGY
End-Markets:
Mobile/Consumer etc.
End Systems/
Phones/
Wearables
Applications
such as PMIC /
SoC,etc.
PackageType
# of Dies,
Components,
Package
Construction
# ofWafers
OSAT/Foundry Suppliers
Supplier market shares per
package
Top-down approach
Mobile & Consumer
Automotive & Mobility
Telecom & Infrastructure
Medical
Industrial
Defense & Aerospace Bottom-up approach
Advanced Packaging Monitor

KEY TERMS & DEFINITIONS AS USED IN THIS MONITOR
IDM Revenue:
• IDMs such as Intel, Samsung, SK Hynix, TI, and Micron have “in-house” packaging capabilities for internal consumption.
• IDM revenue figures are based on System Plus cost models and expert interviews, and cover “packaging services” valuation for internal IDM consumption. They are NOT
based on any financial reports.
SiP:
• SiP package is defined as FCCSP based multi-die, multi-SMT components with package size typically ranging from 5 x 5 mm to 13 x 13 mm.
• Typical BOM (Bill of Materials) includes substrate, mold, solder balls, and many passive SMT (R, L, C) components.
• SiP substrates can range from 2L to 6L structures. SiP packages include conformal, compartmental shielding, and partial mold processes.
FCCSP:
• Defined as a package that is processed as strip-based typically ranging from 5 x 5 mm to 13 x 13 mm.
• Typical BOM (Bill of Materials) includes substrate, mold, solder balls, and in some cases, underfill.
• FCCSP substrates are typically 2L or 4L substrates, with some ETS based.
• FCCSP revenue is defined as emanating from services that include wafer backgrinding, die singulation and flip chip assembly on the substrate and includes bill of materials,
such as substrate and assembly materials, such as mold.
• FCCSP wafer bumping is reported separately in terms of wafer volume & revenue & supplier market shares.
FCBGA:
• Defined as a singulated package (Not strip-based processing for assembly).
• Typically, larger than 15 x 15 and can go as high as 60 x 60 in high-end applications.
• Typically includes Lid and TIM (Thermal Interface Material) for cooling purposes.
• BOM (Bill of Materials) includes HDI (High Density Interconnect) substrate.
• FCBGA revenue is defined as die prep that includes backgrinding, die singulation and flip chip assembly on the substrate.
• FCBGA wafer bumping is reported separately in terms of wafer volume & revenue & supplier market shares.
WLP:
• Defined as a wafer level package that is processed based on wafer level manufacturing process.
• WLP package can have the same package size as the starting die dimensions, as in the case of WLCSP.
• WLP package can have larger package size than the die size as seen in many FO (Fan-Out) packages.
• WLP package BOM does NOT include any substrate. However, WLP BOM can include assembly materials, such as backside lamination and mold compound in the case of a
fan-out package.

7
7
ADVANCED PACKAGING MONITOR - MARKET SEGMENTATION
Market is sized by packaging platforms* for each modules
• Core FO
• HD FO
• UHD FO
• Multi-die
• IC Substrate
Fan-Out
Packaging
--
Module I
• Fan-In • CIS
• 3D NAND
• 3D SoC
• Embedded Si
Bridge
• IC Substrate
• Active/Passive Si
Interposer
• 3DS
• HBM
2.5D/3D Stacked
Packaging
--
Module III
• FC of BGA
• Multi-die
• IC Substrate
FCBGA
Packaging
--
Module IV
• FC of CSP
• Multi-die
• IC Substrate
FCCSP
Packaging
--
ModuleV
WLCSP
Fan-In Packaging
--
Module II
• FC +WB
• Mainly RFs
• Multi-die
• IC Substrate
• FC
• Mainly RFs
• Multi-die
• IC Substrate
System-in-Package
(SiP)
--
ModuleVI
Packaging platforms*: Assembly, Bumping,RDL, TSV, bonding, integration processing like back grinding, die singulations etc are generally included in market sizing.
IC Substrate is not generally included in market sizing unless stated otherwise.
Die ASP and Final package testing ASP is not included in market sizing
Si interposer excluded in this
module. Si interposer is
accounted in Module 3.
Some of the SiPs are also
included in the
FO/2.5D/3D/BGA.
Not including those in this
modules to prevent oversizing
the market.

8
8
Packaging industry dynamics highlights 12
Analyst commentary 45
Advanced packaging 18
Definition
Roadmaps
Supply chain
Key metrics at a glance 31
• Revenue (WLP,WLCSP, FO, 3D, FCBGA,FCCSP)
• Shipments (WLP,WLCSP,FO, 3D, FCBGA, FCCSP)
• Market Shares (WLP,WLCSP, FO, 3D, FCBGA, FCCSP)
• Summary of WLCSP, FOWLP & FOPLP, 3D, FCBGA, FCCSP
market dynamics
System demand 54
WLCSP package demand 58
FO package demand 59
3D-stacked package demand 60
FCBGA package demand 61
FCCSP package demand 62
FCCSP packaging market dynamics 63
• Revenue – historical & forecast
• Shipments – historical & forecast
• Supplier market shares (OSAT/FOUNDRY/IDM)/
• Long-term/Near-term dynamics & FC CapEx
FCBGA packaging market dynamics 83
• Supplier market shares (OSAT/FOUNDRY/IDM)
• Long-term/Near term dynamics
3D-stacked packaging market dynamics 101
• Supplier market shares (OSAT/FOUNDRY/IDM)
• Long-term/Near-term dynamics
TABLE OF CONTENTS

9
9
WLCSP market dynamics – summary 117
• Supplier market shares (OSAT/FOUNDRY)
• WLCSP ASP per market & size
• Near-term shipment & pricing outlook
• Capex & capacity
FOWLP & FOPLP market dynamics 135
• FOWLP/FOPLP market dynamics – summary
• FOWLP ASP per market & size
System-in-Package (SiP) market dynamics 151
TABLE OF CONTENTS
Player/manufacturer details 160
• Foundry
• TSMC
• UMC
• IDM
• INTEL
• SONY
• SAMSUNG
• TI
• MICRON
• SK HYNIX
• YMTC
• OSATs/Substrate suppliers
• SEMCO
• ASE w/SPIL
• JCET
• AMKOR
• PTI
• TFME
• NEPES LAWEH/DECA
• CHINA WLCSP
• HUATIAN

10
WHO SHOULD BE INTERESTED INTHIS MONITOR
Equipment & material suppliers:
o To identify new business opportunities and prospects
o To understand the differentiated value of your products and technologies
o To identify technology trends, challenges and precise requirements
o To evaluate your Advanced Packaging technologies’ market potential
o To position your company in the market
o To monitor and benchmark your competitors
OSATs, IDMs & foundries:
o To understand technology trends related to Advanced Packaging platforms
o To spot new opportunities and define diversification strategies
o To understand the overall Advanced Packaging market
o To monitor and benchmark potential competitors
o To understand the supply chains involved in Advanced Packaging
R&D organizations:
o To evaluate the potential of future technologies and products
o Identify market needs for new applications
o To understand the bottle necks of the Advanced Packaging technology and
direct their resources to solve the technical issues
o To identify the best candidates for technology transfers
o To identify the partners or consortia
Financial & strategic investors:
To identify new business opportunities and prospects
To understand the market potential of Advanced Packaging
To understand which players will benefit from Advanced Packaging adoption
To understand the players that are investing in Advanced Packaging business
OEMs & integrators:
To understand technology trends in Advanced Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Advanced Packaging market
To monitor and benchmark potential competitors
To understand the supply chains including the equipment / material suppliers

Top OSATs saw a 15-20% increase in 2020 revenue compared to 2019, and 2021 is expected to shape up as a “BannerYear” for OSATs.
A RECORDYEAR FOR OSATS (PACKAGING REVENUE)
23,7%
-4,8%
-6,5%
9,2%
11,6%
29,0%
10,0%
46,7%
-1,1%
20,3%
24,8%
32,5%
-15,3%
31,2%
8,8%
67,9%
-1,2%
16,9%
21,3%
21,6%
18,3%
41,1%
22,8%
23,4%
24,6%
11,3%
Lingsen Precision Industries
Walton Advanced Engineering
Inari Berhad
Nepes Corporation
Unisem Berhad
Ardentec
Formosa Advanced Technologies
Tong Hsing
AOI Electronics
LB Semicon Inc
Carsem
Sigurd Microelectronics
Orient Semiconductor Electronics
Greatek Elec
SFA semicon
Hana Micron (w/o Hana Materials)
UTAC
Chipbond Technology
ChipMOS Technologies
King Yuan Electronics
Tianshui Huatian Microelectronics
Tongfu Microelectronics
Powertech Technology
JCET Group
Amkor
ASE (w/ SPIL & w/o USI)
YoY Growth [%]
194
212
247
316
319
344
346
362
394
407
423
442
493
523
527
680
702
793
819
1 031
1 284
1 649
2 712
4 054
5 051
9 415
Inari Berhad
Nepes Corporation
Unisem Berhad
Ardentec
Tong Hsing
AOI Electronics
LB Semicon Inc
Carsem
Greatek Elec
SFA semicon
UTAC
Chipbond Technology
JCET Group
Amkor
Top OSAT Ranking by 2020 Revenue [$M]
157
223
264
289
286
267
314
247
398
338
339
334
582
399
484
405
710
678
675
848
1 085
1 169
2 209
3 285
4 053
8 456
Inari Berhad
Nepes Corporation
Unisem Berhad
Ardentec
Tong Hsing
AOI Electronics
LB Semicon Inc
Carsem
Greatek Elec
SFA semicon
UTAC
Chipbond Technology
JCET Group
Amkor
Top OSAT Ranking by 2019 Revenue [$M]

2021 CAPEX HIGHLIGHTS FOR ADVANCED PACKAGING PLAYERS
$XX B

ADVANCED PACKAGING MARKET DYNAMICS – REVENUE
Advanced Packaging market revenue is expected to grow at 8.96% CAGR,from $23B in 2020 to $40B by 2026.
5G, automotive infotainment/ADAS,AI, data center and wearable application megatrends continue to AP forward.

ADVANCED PACKAGING MARKET DYNAMICS – UNITS
Advanced Packaging form factors are expected to grow at 6.7% CAGR2020-2026 with FCCSP and WLCSP leading in
terms of total number of units and 2.5D/3D in terms of growth rates

ADVANCED PACKAGING MARKET DYNAMICS – WAFER
Total Advanced Packaging 300 mm eq. wafer output is expected to grow at 8.12% CAGR2020-2026 with FCCSP and
FCBGA to take the major share over the next few years and 2.5D/3D growing at the fastest rate
Note that FCCSP, FCBGA and SiP include only dies at wafer-level bumping

TSMC remains the leader with 67% of the market for fan-out packages in 2020.
FO PACKAGE 2020 SUPPLIER MARKET SHARES (BY REVENUE)
Amkor
3,0%
ASE Group
20,3%
Huatian
0,5%
JCET Group
4,9%
Nepes Laweh
1,9%
PTI
1,9%
Samsung Electronics
0,7%
TSMC
66,9%
2020:fan-out packaging market shares
2020
$1.5B

Revenue forTop 10WLCSP suppliers approaching $2.4B in 2020
WLCSP PACKAGE SUPPLIER MARKET SHARES (2020 - REVENUE)
TSMC
9% Samsung Electronics
7%
Amkor
16%
JCET
15%
ASE w/ SPIL
34%
Huatian
4%
Nepes
3%
ChinaWLCSP
2%
TI
3%
Others
7%
2020WLCSP market shares (by revenue)
Others**: Include NXP, UniSem, PTI, Chipbond, etc.…
2020
$2.4B

TSMC
UMC
Intel
Samsung Electronics
SK Hynix
YMTC
Sony
Others
3D stacked IC supplier market shares (2020)
2020
$2.1B
3D STACKED IC PACKAGE 2020 SUPPLIER MARKET SHARES (BY REVENUE)
3D Stacked IC packaging market has passed the $2B threshold with Sony and Samsung dominating,together holding 74% of the market.
Others**: Include OVT,AMS,Authentec (Apple subsidiary), Broadcom, etc.

19
19

SIP MODULE SCOPE
• RF SiP components and connectivity modules used in handset application are included in this module.
• Other modules have accounted for other types of SiPs.
• Assembly of various RF components in SiPs basically consists of 2 processes: wafer level assembly & SiP level assembly
• In this module, only SiP level packaging assembly is covered, Wafer level packaging assembly is not covered
Assembly of RF
components
SiP level
Wafer level
SMT Wire bond Molding Shielding BGA/LGA Test
Filter
Switches
Multiple radio support
Filter and switches
FEM
PA
PMIC
Switches
Single radio support
2G, 3G, 4G or 5G
PAM
PMIC
MMIC
Optional
FEM
Antennas
5G mmWave support
MMIC, PMIC, eventually a FEM
and integrated antenna
AiP WiFi/BT
Wi-Fi/BT
SoC
PA
LNA
Filter
Switch
Multiple possible configuration of the
Wi-Fi link in smartphones
Cap wafer
bonding
TSV
RDL/
UBM
Bumping Dicing
Wafer
grinding
Wafer
dicing
Inspection
Components available as SMT components
in SiP assembly / Flip-chip
Components available as bare dies (in wafer
form) in SiP assembly / wire-bond process
Not included
in SiP Advanced
Packaging Module
Included
in SiP Advanced
Packaging Module

22
22

23
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?
About Yole Développement | www.yole.fr | ©2021

24
CONTACTS
Western US & Canada
Hal Levy - hal.levy@yole.fr
+ 1 408 334-0554
Eastern US & Canada
ChrisYouman - chris.youman@yole.fr
+1 919 607 9839
Europe and RoW
Lizzie Levenez - lizzie.levenez@yole.f
+49 151 23 54 41 82
DACH (North Germany,Austria,Switzerland)
Neha CHAUDHURY - neha.chaudhury@yole.fr
+49 172 97 47 248
Benelux, UK & Scandinavia
MarineWybranietz - marine.wybranietz@yole.fr
+49 69 96 21 76 78
South Germany & France
Martine Komono - martine.komono@yole.fr
+49 173 69 43 31
India and RoA
Takashi Onozawa - takashi.onozawa@yole.fr
+81 80 4371 4887
Greater China
Mavis Wang - mavis.wang@yole.fr
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - peter.ok@yole.fr
+82 10 4089 0233
Japan
Miho Ohtake - miho.ohtake@yole.fr
+81 34 4059 204
Toru Hosaka – toru.hosaka@yole.fr
+81 90 1775 3866
Japan and Singapore
Itsuyo Oshiba - itsuyo.oshiba@yole.fr
+81 80 3577 3042
FINANCIAL SERVICES
› Jean-Christophe Eloy - eloy@yole.fr
+33 4 72 83 01 80
› Ivan Donaldson - ivan.donaldson@yole.fr
+1 208 850 3914
CUSTOM PROJECT SERVICES
› JéromeAzémar, Yole Développement -
jerome.azemar@yole.fr - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
jcoulon@systemplus.fr - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy,Public Relations
sandrine.leroy@yole.fr - +33 4 72 83 01 89
› General inquiries: info@yole.fr - +33 4 72 83 01 80
REPORTS, MONITORS &TRACKS
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