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Obsolescence 
                      Obsolescence
                   Management & The 
                   Management & The
                     p                 y
                   Impact on Reliability
                               Cheryl Tulkoff
                            ©2012 ASQ & Presentation Cheryl
                             Presented live on Jull 12th, 2012




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Obsolescence Management 

      & The Impact on Reliability
   ASQ Reliability Division Webinar
   Cheryl Tulkoff, ctulkoff@dfrsolutions.com
       July 12, 2012


       – 2010
© 2004 - 2007
         2010
Abstract
   Component obsolescence management is a strategic practice that also mitigates the risk of
   counterfeit parts. Left unchecked, obsolescence issues increase support costs and
   development and production costs. So, planning ahead is key. For companies that
   proactively manage component availability and obsolescence, the effect of long-term
   storage on manufacturability and reliability is an area of major concern.

   When component obsolescence isn’t planned for, the secondary market is often the supply
   chain of last recourse. While it is possible to get high quality, genuine parts, it is also
   possible to get nonconforming, reworked, or counterfeit components. And, it is increasingly
   difficult to differentiate genuine parts from their counterfeit equivalents. Historically, the
   secondary market provided a mechanism for finding parts in short supply or at reduced cost.
   Today, high-reliability system manufacturers are less willing to risk contamination of their
   supply chain with potentially substandard parts in order to save a few dollars on the cost of
   a part. The proliferation of counterfeit components has led to a contraction of the secondary
   market and an increase in the cost of parts in the marketplace.

   This webinar will cover strategies that can be used to protect your company and products
   against obsolescence risk. Topics include relevant industry standards, use of Managed
   Supply Programs (MSP) and Contract Pooled Options, plus long term storage
   recommendations and practices.



© 2004 - 2007
         2010
Obsolescence Management

        o   A strategic practice that also mitigates the risk of
            counterfeit parts
        o   Anticipate & plan for:
            o   Supplier disruption
            o   End of life parts
            o   Aging technologies
            o   Long life programs
        o   Planning ahead is key!
        o   For companies that proactively manage component
            availability and obsolescence, the effect of long-term
            storage is the area of major concern.


© 2004 - 2007
         2010
The Reliability Issues….

        o   The effect of long-term storage on manufacturability
            and reliability is the area of major concern
        o   Many issues can arise depending on the technology
            and storage environment.
        o   Mechanisms of concern include:
            o   Solderability
            o   Stress driven diffusive voiding
            o   Moisture
            o   Kirkendall voiding
            o   Tin whiskering
        o   Of all of these, solderability / wettability remains the
            number one challenge in long-term storage.
© 2004 - 2007
         2010
So, What do You Need to Know?


   o   Industry Standards for Storage Reliability
   o   Use of Managed Supply Programs (MSP) and Contract
       Pooled Options
   o   Long Term Storage Recommendations and Practices
   o   Awareness of Long Term Storage Reliability Issues




© 2004 - 2007
         2010
Industry Standards: ANSI-GEIA-STD-0003
        o   PROCEDURES FOR LONG TERM STORAGE OF
            ELECTRONICS
        o   This document is generated to provide an industry
            standard for Long Term Storage (LTS) of electronic
            devices by drawing from the best long term storage
            practices currently known.
        o   For the purposes of this document, LTS is defined as
            any device storage for more than 12 months but
            typically much longer.
        o   While intended to address the storage of unpackaged
            semiconductors and packaged electronic devices,
            nothing in this standard precludes the storage of other
            items under the storage levels defined herein.

© 2004 - 2007
         2010
ANSI-GEIA-STD-0003 Standard
       o   Packaged Electronic Devices
           o    Electronic Devices are defined as any packaged electrical,
                electronic, electro-mechanical (EEE) item, or assemblies using
                such items.
           o    This standard is intended to ensure that adequate reliability is
                achieved for devices in user applications after long term
                storage.
           o    Users are encouraged to request data from suppliers to this
                specification that demonstrates a successful storage life
                requested by the user.
           o    This standard is not intended to address built-in failure
                mechanisms that would take place regardless of storage
                conditions.
       o   Unpackaged semiconductors
           o    Unpackaged semiconductors are semiconductor wafer or dice.

© 2004 - 2007
         2010
ANSI-GEIA-STD-0003 Standard

         o   Table of Contents:
             o   ACKNOWLEDGMENTS
             o   FOREWORD
             o   1 PURPOSE
                 o 1.1  Scope
             o   2 REFERENCE DOCUMENTS
             o   3 REQUIREMENTS
                 o 3.1  Storage Conditions
                 o 3.2  Storage containers
                 o 3.3  Levels
                 o 3.4  Storage Elements
                 o 3.5  Long Term Storage Control


© 2004 - 2007
         2010
MIL-HDBK-338B Viewpoint

         o   ELECTRONIC RELIABILITY DESIGN HANDBOOK
         o   It has often been assumed in the making of reliability
             predictions that the failure rate of an electronic equipment
             and/or it constituent parts is insignificantly small or even
             zero during the times when the equipment is switched off,
             deenergized or otherwise nonoperational.
         o   Evidence in the field shows otherwise and experimental
             data indicates that the failure rates of many components
             are still very significant even when no electrical stresses are
             applied. This results from the fact that when the electrical
             stresses are removed, many other stresses such as
             temperature, acceleration, shock, corrosive influences,
             humidity, etc., are still present.



© 2004 - 2007
         2010
MIL-HDBK-338B Viewpoint
       o   For example, with semiconductors, temperature has a
           very marked influence; even at room temperatures,
           the temperature dependent failure mechanisms within
           the items are continually active.
       o   For some components, the storage failure rate is even
           greater than the operating failure rate at the lower
           stress levels.
           o    This is the case for some types of resistors (eg. carbon
                composition) where, under storage conditions, there is no
                internal heat generation to eliminate humidity effects.
           o    It is also well known that certain types of electrolytic capacitor
                need a reforming process after a long period of storage.


© 2004 - 2007
         2010
Critical Elements of a Long Term Storage Program

  o   Asset Security
      o   Protect against loss, theft
  o   Component Inspection
      o   Authenticity & quality
  o   Product genealogy (origins) & condition
      o   Data records for manufacture, transportation, and short term storage
          o  Environmental data, Lot codes, Date codes
  o   Storage Environment
      o   GEIA Standards
          o  Active desiccant storage at less than 5% relative humidity
          o  Dry nitrogen storage per MIL-PRF-27401.
  o   Data Management
          o     Maintain and manage individual date and lot codes.
  o   Assured Supply


© 2004 - 2007
         2010
Product Genealogy – Example of Supply Chain Complexity




                Courtesy of Lloyd Condra, Boeing




© 2004 - 2007
         2010
Managed Supply Programs (MSPs)

    o    Several companies offer MSPs as an industry service. Some
         of their offerings include:
         o   Purchasing and holding of obsolete components
         o   Long term storage services
         o   Component contract financing
         o   Stock pooling and optional stock holdings
         o   Product quality inspection and management
         o   Contract terms up to 20 years




© 2004 - 2007
         2010
Contract / Stock Pooling Options
     o   Pay a percentage of part cost over some defined time interval
         from mfg or MSP provider
     o   Less Purchase Investment
         o      Purchasing parts means an upfront cost for the value of the parts.
         o      The percentage will ensure that the part or parts that you need are
                stocked and available when needed
     o   Less Inventory Cost
         o      Insurance
         o      Risk of losing or damaging stocked parts
         o      Storage space
     o   Warranty
         o      The warranty starts when a part is purchased from the pool
         o      With purchased parts, the 1st year warranty granted already starts on the
                date of purchase.


© 2004 - 2007
         2010
Proper IC Storage
   Die / Wafer
   Hermetic Packages
   Plastic Packages


       – 2010
© 2004 - 2007
         2010
Proper IC Storage
    o   For long-term programs, some form of storage should
        be considered. But, it does present problems:
        o Practical/physical space, mechanical, financial, and

          counterfeit products.
        o With appropriate care, ICs can be stored at the

          die/wafer level, or as “finished goods” (packaged).
    o   What do we mean by long-term storage?
        o Commercial: 2 years is very long-term.

        o Military: 20 years and beyond is common.



            Courtesy John O’Boyle – QP Semiconductor

© 2004 - 2007
         2010
Die/Wafer Storage - a.k.a “Die Banking”
    o   Successful storage methodologies include special
        bagging, environmental controls and periodic
        monitoring.
        o Requires care, cleanliness (particulates and gases),
          and benign temperatures.
          o IDMs (integrated device mfgs) do this but few
             distributors do.
        o Controlled atmosphere “dry boxes” (dry nitrogen
          purged storage).
        o Dry bagged/vacuum storage.

        o Oxygen barrier bags designed specifically for
          long-term storage.
                Courtesy John O’Boyle – QP Semiconductor
© 2004 - 2007
         2010
Die/Wafer Storage Advantages

    o   Compact – container
        on the right holds 9
        wafers with gross die
        count of 64,000. (Note
        Data CD in photo)
    o   Flexible form factor –
        can build parts in any
        desired package.


        Courtesy John O’Boyle – QP Semiconductor

© 2004 - 2007
         2010
Hermetic Packages
    o   Minimize moisture intrusion
    o   20 year storage is routine
        o Metal TO-3 “can”

        o Ceramic and side-brazed packages

           o DIP, LCC, flat pack, and PGA

    o   Keep them dry and in environments
        low in sulfur, chlorine, and
        hydrocarbons to preserve solder
        finish on lead frame.


© 2004 - 2007
         2010
Hermetic Disadvantages/Advantages
       o   Cannot change package type.
       o   Slightly more expensive to store than
           die bank.
       o   Large storage space required.
       o   Easy storage infrastructure.
       o   Long life time storage.


© 2004 - 2007
         2010
Common Misconceptions about Plastic

       o   Come from the manufacturer in sealed
           packaging and thus don’t need special
           handling/storage.
       o   Not rated as moisture sensitive and thus
           okay.
       o   Safe to store in a “normal room”
           environment.

© 2004 - 2007
         2010
Plastic Packages
o   Plastic is hygroscopic
    o    Attracts water molecules from
         the environment.
    o    Achieve equilibrium in 4 to 28
         days depending on molding
         compound.
    o    Normal room considered
         “wet” for plastic ICs (LAX
         annual average RH: +70%*)
    o    Store in “dry bags” or in a                         Source: Plastic Package Moisture-Induced Cracking, April 2006,
                                                                        National Semiconductor Application Note

         <10% RH environment
        * LAX weather station - indoor data over 31 years.

© 2004 - 2007
         2010
Wait a Minute!
   o   “4 days?”
       o   That’s the time for the moisture to reach
           equilibrium
       o   Takes a longer time for damage to occur
   o   “Normal room is WET?”
       o   Well, when the device is turned on, the die
           heats and the moisture is driven out.
       o   But you don’t normally store them powered up,
           do you?
                Courtesy John O’Boyle – QP Semiconductor

© 2004 - 2007
         2010
But, Water doesn’t hurt Plastic!
   o   It’s not the plastic we’re worried about!
       o   Water leaches/reacts with:
           o    Materials out of the mold compound
           o    Elements in the gases in the environment
           o    Other materials deposited on the outside of the package.
       o   Water corrodes and degrades the metal pads and wires
           and results in device failure.
   o   Isn’t plastic “rated” as non-moisture sensitive?
       o   Yes. But this rating is for IC/board assembly for reflow
           solder heat induced delamination and popcorning.
   o   Contrary to popular belief, it is not a rating for long-
       term storage!
  Courtesy John O’Boyle – QP Semiconductor

© 2004 - 2007
         2010
IC Storage: Good and Bad News
   o   Good: You can store wafers, die, or packages
       o Wafers or hermetic parts: store in a dry environment.

       o Plastic finished goods require a dry environment with periodic

         monitoring.
       o Having spares essentially eradicates the problem of locating

         EOL/obsolete parts in the future.
   o   Bad: May be prohibited by regulation (FAR).
       o Federal Acquisition Regulations (FAR) often limits procurement
         to one or two years.
       o Systems manufacturers have rarely funded this long-term
         procurement on their “own dollar.”

© 2004 - 2007
         2010
Storage Options: Summary




© 2004 - 2007
         2010
Long Term Storage Case Study
     o   In this case study, solderability was assessed for:
         o Components from three different reels

         o Stored for up to five years to determine how much
           additional storage life was available.
         o Either an ASIC in a SOIC package or a MOSFET in

           a TO-252 package.
         o In both package styles, the lead frame plating was
           tin-based.



© 2004 - 2007
         2010
Case Study (continued)
   o   Type of plating material drives the appropriate
       solderability test
       o   In this case, tin can either oxidize and/or form intermetallics with the base
           metal underneath.
       o   Both reactions can detrimentally reduce the solderability of the component.
   o   To assess these reactions, the components were subjected to
       steam aging to accelerate storage related effects on
       solderability.
       o   Elevated temperature accelerates tin-copper intermetallic growth
       o    Steam accelerates tin oxide formation.
       o   Components were then tested for solder wettability using a wetting balance
           test.



© 2004 - 2007
         2010
Steam Aging Apparatus and Approach
   • The steaming apparatus was constructed
     as per IPC-TR-464.
   • Components are placed in the “dead
     bug” position on an inert and heat
     resistant polypropylene stage.
   • With this method, components are held at
     approximately 93°C, between 80% and
     90% relative humidity (RH), and no more
     than 1 1/2" from the surface of the
     boiling water.
   • Each day exposed to this accelerated
     steam aging method is considered
     equivalent to one year in storage. Three
     components from each reel were aged
     for 0, 12, 24, 48 and 72 hours,
     corresponding to 0, 0.5, 1, 2 and 3 years
     of additional storage.
                                                 Apparatus for Steam Aging



© 2004 - 2007
         2010
Solderability Measurements
  o   Measurements of the wettability of
      the leads performed using a solder
      meniscus measuring device (Wetting
      Balance) for each component.
  o   All parts were tested with a
      standard RMA flux.
      o   Recommended procedure detailed in
          IPC/EIA J-STD-002C.
  o   3 components from each reel were
      tested.
© 2004 - 2007
         2010
Solderability Measurements
     o   The acceptance criterion from J-STD-002C is provided
         in Chart 1 below
         o      Set A more stringent than Set B.




© 2004 - 2007
         2010
Case Study Results
     o   TO252 (production year 2003). Solderability is already
         impaired.
         o                   Dashed line indicates a part which was tested with a more active
                             water soluble flux. Notice the significant improvement in wettability.
         o                   Suggests the mechanism for poor wetting is thick oxide (as opposed
                             to intermetallic formation).  Wetting Force
                                                           DCC03994DC


                                    400

                                    350

                                    300
                                                                                             Hours
                                                                                             Aged
                                    250
                                                                                                 0
                                                                                                 0
             Force (uN/mm)




                                    200                                                          0
                                                                                                 12
                                                                                                 12
                                    150
                                                                                                 12
                                                                                                 24
                                    100                                                          24
                                                                                                 24
                                                                                                 48
                                     50                                                          48
                                                                                                 48
                                      0                                                          72
                                                                                                 72
                             -0.5          0.5   1.5        2.5            3.5   4.5   5.5
                                                                                                 72
                                     -50

                                    -100
                                                       time (seconds)




© 2004 - 2007
         2010
Case Study Results
     o   TO252 (production year 2000). Even though this part is
         older, initial solderability is superior to the 2003 part.
     o   After 12 hours of steam aging (equivalent to six months),
         solderability has deteriorated.                      Wetting Force
                                                              DK0060112G


                                       400

                                       350

                                       300

                                                                                                Hours
                                       250                                                      Aged
                Force (uN/mm)




                                                                                                   0
                                       200                                                         0
                                                                                                   0
                                                                                                   12
                                       150                                                         12
                                                                                                   12
                                       100                                                         24
                                                                                                   24
                                                                                                   24
                                        50                                                         48
                                                                                                   48
                                                                                                   48
                                         0                                                         72
                                -0.5          0.5   1.5        2.5            3.5   4.5   5.5      72
                                                                                                   72
                                        -50

                                       -100
                                                          time (seconds)




© 2004 - 2007
         2010
Case Study Results
  o   SOIC (production year N/A). Solderability degrades slowly.
  o   The part does not become completely unwettable, like the
      TO252 parts, but fails IPC criteria after 24 hours of steam
      aging (equivalent to 1 year of storage).          Wetting Force
                                                            SOIC


                                  400

                                  350

                                  300
                                                                                          Hours
                                                                                          Aged
                                  250
                                                                                             0
           Force (uN/mm)




                                                                                             0
                                  200                                                        0
                                                                                             12
                                  150                                                        12
                                                                                             12
                                                                                             24
                                  100                                                        24
                                                                                             24
                                                                                             48
                                   50
                                                                                             48
                                                                                             48
                                    0                                                        72
                           -0.5          0.5   1.5        2.5           3.5   4.5   5.5      72
                                                                                             72
                                   -50

                                  -100
                                                     time (seconds)




© 2004 - 2007
         2010
Discussion and Conclusions
      o   The same components produced by the same
          manufacturer can display very different behaviors
          in regards to long-term solderability.
          o     This was seen with the TO252 parts, where the parts
                fabricated in 2000 had better wettability than the parts
                fabricated in 2003.
          o     Therefore, any component or obsolescence storage
                strategy should involve an initial solderability assessment
                of each part and date code combination.




© 2004 - 2007
         2010
Discussion and Conclusions
       o   Any concern with poor solderability, if driven by
           oxidation formation, can be potentially mitigated
           through the use of more aggressive flux formulations.
       o   This may require contingency planning for assembly of
           components after long-term storage, including
           movement from L to M to possibly H flux chemistries
           and introducing modified cleaning processes to ensure
           these chemistries are effectively removed after
           soldering.
       o   It also clearly demonstrates that the most critical
           parameter to control during long-term storage is
           temperature, as oxide formation can be potentially
           remedied while intermetallic formation cannot.

© 2004 - 2007
         2010
Long Term Storage
      Reliability Issues
     Intermetallics
     Stress driven diffusive voiding
     Tin whiskering
     Moisture
     Kirkendall voiding
       – 2010
© 2004 - 2007
         2010
Intermetallics / Oxidation
        o   Intermetallic compounds form when two unlike metals
            diffuse into one another creating species materials
            which are combinations of the two materials.
        o   Intermetallic growth is the result of the diffusion of one
            material into another via crystal vacancies made
            available by defects, contamination, impurities, grain
            boundaries and mechanical stress
        o   There are a number of locations within the electronic
            package where these dissimilar metals are joined.
            o   These include:
                o Die level interconnects, wire bonds

                o Plating finishes on lead frames

                o Solder joints, flip chip interconnects, etc...



© 2004 - 2007
         2010
Intermetallics / Oxidation
     Growth of intermetallics during the storage period may occur and
     may reduce the strength or increase the resistance of the
     interconnect due to the properties of the intermetallic or from
     Kirkendall voiding.

     Intermetallic layer thickness can be estimated by following
     equation:
                              X= Kt 1/2
     Where X is the intermetallic layer thickness, t is the time and K is
     the rate constant which is calculated by following:
                              K=Ce -E/KT
     Where C is the rate constant (there are nine different ones listed
     by Philofsky), e is the activation energy (typically 0.4 to 0.9 eV), K
     is the Boltzmann constant, and T is the temperature in absolute
     scale.

© 2004 - 2007
         2010
Stress Driven Diffusive Voiding
    o   Stress Driven Diffusive Voiding in on-die interconnects
        results from the mismatch in coefficient of thermal
        expansion between the dielectric layers and the
        metallization itself.
        o   Aluminum has a very high coefficient of thermal expansion (~27
            ppm/ºC) while SiO2 has a fairly low coefficient of thermal
            expansion (~4 ppm/ºC).
    o   Since metal deposition operations during semiconductor
        manufacturing are performed at elevated temperatures,
        the metallization contracts as it cools, causing it to be in
        tensile state.
    o   These tensile stresses relax over a period of time resulting
        in small movements (diffusion) of metal atoms.
        o   This movement can result in a void or an open interconnect.


© 2004 - 2007
         2010
Stress Driven Diffusive Voiding
  o   Compressive stresses from the
      molding process can also cause
      movement of metallization
      atoms. This can cause thinning
      of the interconnect resulting in
      greater current densities during
      operation.
  o   These current densities may be
      sufficiently high to cause
      electromigration which can also
      lead to an interconnect open.
                                         Image courtesy
                                         of Micron

© 2004 - 2007
         2010
Tin Whiskers
   o   A tin whisker is a single crystal growth
       that can occur on tin plated lead frames.
   o   Mechanism for the growth is not clearly
       understood but it does appear to be
       related to compressive stresses in the
       plating, moisture, and contamination.
   o   May be an issue for alloy 42 lead frames
       with pure tin platings since large
       compressive stresses are present due to
       the CTE mismatch between the alloy 42
       and the tin.
   o   Tin whiskers can lead to shorting,
       intermittent errors, and high frequency
       issues.



© 2004 - 2007
         2010
Moisture
       o   Depending on storage time & conditions,
           parts may be subjected to moisture.
       o   May be from
           o    Overloading of the desiccant with moisture
           o    Failure of the storage bags
           o    Improper storage.
       o   Presence of moisture can lead to corrosion
           issues and other failures such as popcorning.


© 2004 - 2007
         2010
Failure Modes Encountered With Stored Electronic Components
  Component                                Failure Modes
  Batteries                                Dry batteries have limited shelf life. They become unusable at low temperatures
                                           and deteriorate rapidly at temperatures above 35C. The output of storage
                                           batteries drops as low as 10 percent at very low temperatures.

  Capacitors                               Moisture permeates solid dielectrics and increases losses which may lead to
                                           breakdown. Moisture on plates of an air capacitor changes the capacitance.
  Coils                                    Moisture causes changes in inductance and loss in Q. Moisture swells phenolic
                                           forms. Wax coverings soften at high temperatures.

  Connectors                               Corrosion causes poor electrical contact and seizure of mating members. Moisture
                                           causes shorting at the ends.
  Relays & Solenoids                       Corrosion of metal parts causes malfunctioning. Dust and sand damage the
                                           contacts. Fungi grows on coils.
  Resistors                                The values of composition-type fixed resistors drift and these resistors are not
                                           suitable above 85C. Enameled and cement-coated resistors have small pinholes
                                           which bleed moisture, accounting for eventual breakdown. Precision wire-wound
                                           fixed resistors fail rapidly when exposed to high humidities and to temperatures
                                           at about 125c.

  Diodes, transistors, and microcircuits   Plastic encapsulated devices offer poor hermetic seal resulting in shorts or opens
                                           caused by chemical corrosion or moisture.
  Motors, Blowers, and Dynamotors          Swelling and rupture of plastic parts and corrosion of metal parts. Moisture
                                           absorption and fungus growth on coils. Sealed bearings are subject to failure.

  Plugs, jacks, Dial-Lamp sockets          Corrosion and dirt produce high resistance contacts. Plastic insulation absorbs
                                           moisture.
  Switches                                 Metal parts corrode, and plastic and wafers warp due to moisture absorption.
  Transformers                             Windings corrode causing shorts or open circuits.




© 2004 - 2007
         2010
Printed Circuit Board Storage
  o   Common Pb-free board platings:
      o   Electroless nickel/immersion gold
          (ENIG)
      o   Immersion tin (ImSn)
      o   Immersion silver (ImAg)
      o   Organic solderability preservative
          (OSP)
      o   Pb-free HASL
  o   Failure mechanisms or quality
      issues are pretty well known at
      this point.
      o   Black Pad with ENIG
      o   Creep Corrosion with ImAg

© 2004 - 2007
         2010
Printed Circuit Board Storage
     o   If you have always used SnPb HASL plated boards, the
         biggest change will be storage times.
     o   Except for ENIG, which many companies avoid because
         of cost, all alternative Pb-free platings should be
         limited to 12 months of storage.
     o   Over time ImSn will form intermetallics (temperature),
         OSP-coated copper will oxidize (humidity), and ImAg
         will tarnish (gaseous sulfides).




© 2004 - 2007
         2010
KIRKENDALL VOIDING
  o   Another issue with board plating that also involves solder is
      Kirkendall voiding
      o   Occurs when voids form at the interface between two dissimilar
          materials due to differential diffusion. If these voids coalesce, solder
          joint failure is more likely, especially under mechanical shock/drop
          conditions.




© 2004 - 2007
         2010
General Storage Reliability Checklist




© 2004 - 2007
         2010
Summary

        o   Managing obsolescence issues is critical!
        o   Anticipate and plan
        o   Implement a robust long term storage program which
            considers:
            o   Asset Security
            o   Component Inspection
            o   Product genealogy (origins) & condition
            o   Storage Environment
            o   Data Management
            o   Assured Supply
        o   Be aware of the potential reliability issues.

© 2004 - 2007
         2010
Instructor Biography
       o   Cheryl Tulkoff has over 22 years of experience in electronics manufacturing
           with an emphasis on failure analysis and reliability. She has worked throughout
           the electronics manufacturing life cycle beginning with semiconductor fabrication
           processes, into printed circuit board fabrication and assembly, through
           functional and reliability testing, and culminating in the analysis and evaluation
           of field returns. She has also managed no clean and RoHS-compliant conversion
           programs and has developed and managed comprehensive reliability
           programs.

       o   Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia
           Tech. She is a published author, experienced public speaker and trainer and a
           Senior member of both ASQ and IEEE. She holds leadership positions in the IEEE
           Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR
           (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE
           ASTR workshop for four years and is also an ASQ Certified Reliability
           Engineer.

       o   She has a strong passion for pre-college STEM (Science, Technology,
           Engineering, and Math) outreach and volunteers with several organizations that
           specialize in encouraging pre-college students to pursue careers in these fields.



© 2004 - 2007
         2010
Contact Information

         Any Questions?
         Contact Cheryl Tulkoff, ctulkoff@dfrsolutions.com,
         512-913-8624

         Connect with me on Linked In!

         www.dfrsolutions.com




© 2004 - 2007
         2010

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Obsolescence management & the impact on reliability

  • 1. Obsolescence  Obsolescence Management & The  Management & The p y Impact on Reliability Cheryl Tulkoff ©2012 ASQ & Presentation Cheryl Presented live on Jull 12th, 2012 http://reliabilitycalendar.org/The_Re liability_Calendar/Webinars_ liability Calendar/Webinars ‐ _English/Webinars_‐_English.html
  • 2. ASQ Reliability Division  ASQ Reliability Division English Webinar Series English Webinar Series One of the monthly webinars  One of the monthly webinars on topics of interest to  reliability engineers. To view recorded webinar (available to ASQ Reliability  Division members only) visit asq.org/reliability ) / To sign up for the free and available to anyone live  webinars visit reliabilitycalendar.org and select English  Webinars to find links to register for upcoming events http://reliabilitycalendar.org/The_Re liability_Calendar/Webinars_ liability Calendar/Webinars ‐ _English/Webinars_‐_English.html
  • 3. Obsolescence Management 
 & The Impact on Reliability ASQ Reliability Division Webinar Cheryl Tulkoff, ctulkoff@dfrsolutions.com July 12, 2012 – 2010 © 2004 - 2007 2010
  • 4. Abstract Component obsolescence management is a strategic practice that also mitigates the risk of counterfeit parts. Left unchecked, obsolescence issues increase support costs and development and production costs. So, planning ahead is key. For companies that proactively manage component availability and obsolescence, the effect of long-term storage on manufacturability and reliability is an area of major concern. When component obsolescence isn’t planned for, the secondary market is often the supply chain of last recourse. While it is possible to get high quality, genuine parts, it is also possible to get nonconforming, reworked, or counterfeit components. And, it is increasingly difficult to differentiate genuine parts from their counterfeit equivalents. Historically, the secondary market provided a mechanism for finding parts in short supply or at reduced cost. Today, high-reliability system manufacturers are less willing to risk contamination of their supply chain with potentially substandard parts in order to save a few dollars on the cost of a part. The proliferation of counterfeit components has led to a contraction of the secondary market and an increase in the cost of parts in the marketplace. This webinar will cover strategies that can be used to protect your company and products against obsolescence risk. Topics include relevant industry standards, use of Managed Supply Programs (MSP) and Contract Pooled Options, plus long term storage recommendations and practices. © 2004 - 2007 2010
  • 5. Obsolescence Management o A strategic practice that also mitigates the risk of counterfeit parts o Anticipate & plan for: o Supplier disruption o End of life parts o Aging technologies o Long life programs o Planning ahead is key! o For companies that proactively manage component availability and obsolescence, the effect of long-term storage is the area of major concern. © 2004 - 2007 2010
  • 6. The Reliability Issues…. o The effect of long-term storage on manufacturability and reliability is the area of major concern o Many issues can arise depending on the technology and storage environment. o Mechanisms of concern include: o Solderability o Stress driven diffusive voiding o Moisture o Kirkendall voiding o Tin whiskering o Of all of these, solderability / wettability remains the number one challenge in long-term storage. © 2004 - 2007 2010
  • 7. So, What do You Need to Know? o Industry Standards for Storage Reliability o Use of Managed Supply Programs (MSP) and Contract Pooled Options o Long Term Storage Recommendations and Practices o Awareness of Long Term Storage Reliability Issues © 2004 - 2007 2010
  • 8. Industry Standards: ANSI-GEIA-STD-0003 o PROCEDURES FOR LONG TERM STORAGE OF ELECTRONICS o This document is generated to provide an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. o For the purposes of this document, LTS is defined as any device storage for more than 12 months but typically much longer. o While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. © 2004 - 2007 2010
  • 9. ANSI-GEIA-STD-0003 Standard o Packaged Electronic Devices o Electronic Devices are defined as any packaged electrical, electronic, electro-mechanical (EEE) item, or assemblies using such items. o This standard is intended to ensure that adequate reliability is achieved for devices in user applications after long term storage. o Users are encouraged to request data from suppliers to this specification that demonstrates a successful storage life requested by the user. o This standard is not intended to address built-in failure mechanisms that would take place regardless of storage conditions. o Unpackaged semiconductors o Unpackaged semiconductors are semiconductor wafer or dice. © 2004 - 2007 2010
  • 10. ANSI-GEIA-STD-0003 Standard o Table of Contents: o ACKNOWLEDGMENTS o FOREWORD o 1 PURPOSE o 1.1 Scope o 2 REFERENCE DOCUMENTS o 3 REQUIREMENTS o 3.1 Storage Conditions o 3.2 Storage containers o 3.3 Levels o 3.4 Storage Elements o 3.5 Long Term Storage Control © 2004 - 2007 2010
  • 11. MIL-HDBK-338B Viewpoint o ELECTRONIC RELIABILITY DESIGN HANDBOOK o It has often been assumed in the making of reliability predictions that the failure rate of an electronic equipment and/or it constituent parts is insignificantly small or even zero during the times when the equipment is switched off, deenergized or otherwise nonoperational. o Evidence in the field shows otherwise and experimental data indicates that the failure rates of many components are still very significant even when no electrical stresses are applied. This results from the fact that when the electrical stresses are removed, many other stresses such as temperature, acceleration, shock, corrosive influences, humidity, etc., are still present. © 2004 - 2007 2010
  • 12. MIL-HDBK-338B Viewpoint o For example, with semiconductors, temperature has a very marked influence; even at room temperatures, the temperature dependent failure mechanisms within the items are continually active. o For some components, the storage failure rate is even greater than the operating failure rate at the lower stress levels. o This is the case for some types of resistors (eg. carbon composition) where, under storage conditions, there is no internal heat generation to eliminate humidity effects. o It is also well known that certain types of electrolytic capacitor need a reforming process after a long period of storage. © 2004 - 2007 2010
  • 13. Critical Elements of a Long Term Storage Program o Asset Security o Protect against loss, theft o Component Inspection o Authenticity & quality o Product genealogy (origins) & condition o Data records for manufacture, transportation, and short term storage o Environmental data, Lot codes, Date codes o Storage Environment o GEIA Standards o Active desiccant storage at less than 5% relative humidity o Dry nitrogen storage per MIL-PRF-27401. o Data Management o Maintain and manage individual date and lot codes. o Assured Supply © 2004 - 2007 2010
  • 14. Product Genealogy – Example of Supply Chain Complexity Courtesy of Lloyd Condra, Boeing © 2004 - 2007 2010
  • 15. Managed Supply Programs (MSPs) o Several companies offer MSPs as an industry service. Some of their offerings include: o Purchasing and holding of obsolete components o Long term storage services o Component contract financing o Stock pooling and optional stock holdings o Product quality inspection and management o Contract terms up to 20 years © 2004 - 2007 2010
  • 16. Contract / Stock Pooling Options o Pay a percentage of part cost over some defined time interval from mfg or MSP provider o Less Purchase Investment o Purchasing parts means an upfront cost for the value of the parts. o The percentage will ensure that the part or parts that you need are stocked and available when needed o Less Inventory Cost o Insurance o Risk of losing or damaging stocked parts o Storage space o Warranty o The warranty starts when a part is purchased from the pool o With purchased parts, the 1st year warranty granted already starts on the date of purchase. © 2004 - 2007 2010
  • 17. Proper IC Storage Die / Wafer Hermetic Packages Plastic Packages – 2010 © 2004 - 2007 2010
  • 18. Proper IC Storage o For long-term programs, some form of storage should be considered. But, it does present problems: o Practical/physical space, mechanical, financial, and counterfeit products. o With appropriate care, ICs can be stored at the die/wafer level, or as “finished goods” (packaged). o What do we mean by long-term storage? o Commercial: 2 years is very long-term. o Military: 20 years and beyond is common. Courtesy John O’Boyle – QP Semiconductor © 2004 - 2007 2010
  • 19. Die/Wafer Storage - a.k.a “Die Banking” o Successful storage methodologies include special bagging, environmental controls and periodic monitoring. o Requires care, cleanliness (particulates and gases), and benign temperatures. o IDMs (integrated device mfgs) do this but few distributors do. o Controlled atmosphere “dry boxes” (dry nitrogen purged storage). o Dry bagged/vacuum storage. o Oxygen barrier bags designed specifically for long-term storage. Courtesy John O’Boyle – QP Semiconductor © 2004 - 2007 2010
  • 20. Die/Wafer Storage Advantages o Compact – container on the right holds 9 wafers with gross die count of 64,000. (Note Data CD in photo) o Flexible form factor – can build parts in any desired package. Courtesy John O’Boyle – QP Semiconductor © 2004 - 2007 2010
  • 21. Hermetic Packages o Minimize moisture intrusion o 20 year storage is routine o Metal TO-3 “can” o Ceramic and side-brazed packages o DIP, LCC, flat pack, and PGA o Keep them dry and in environments low in sulfur, chlorine, and hydrocarbons to preserve solder finish on lead frame. © 2004 - 2007 2010
  • 22. Hermetic Disadvantages/Advantages o Cannot change package type. o Slightly more expensive to store than die bank. o Large storage space required. o Easy storage infrastructure. o Long life time storage. © 2004 - 2007 2010
  • 23. Common Misconceptions about Plastic o Come from the manufacturer in sealed packaging and thus don’t need special handling/storage. o Not rated as moisture sensitive and thus okay. o Safe to store in a “normal room” environment. © 2004 - 2007 2010
  • 24. Plastic Packages o Plastic is hygroscopic o Attracts water molecules from the environment. o Achieve equilibrium in 4 to 28 days depending on molding compound. o Normal room considered “wet” for plastic ICs (LAX annual average RH: +70%*) o Store in “dry bags” or in a Source: Plastic Package Moisture-Induced Cracking, April 2006, National Semiconductor Application Note <10% RH environment * LAX weather station - indoor data over 31 years. © 2004 - 2007 2010
  • 25. Wait a Minute! o “4 days?” o That’s the time for the moisture to reach equilibrium o Takes a longer time for damage to occur o “Normal room is WET?” o Well, when the device is turned on, the die heats and the moisture is driven out. o But you don’t normally store them powered up, do you? Courtesy John O’Boyle – QP Semiconductor © 2004 - 2007 2010
  • 26. But, Water doesn’t hurt Plastic! o It’s not the plastic we’re worried about! o Water leaches/reacts with: o Materials out of the mold compound o Elements in the gases in the environment o Other materials deposited on the outside of the package. o Water corrodes and degrades the metal pads and wires and results in device failure. o Isn’t plastic “rated” as non-moisture sensitive? o Yes. But this rating is for IC/board assembly for reflow solder heat induced delamination and popcorning. o Contrary to popular belief, it is not a rating for long- term storage! Courtesy John O’Boyle – QP Semiconductor © 2004 - 2007 2010
  • 27. IC Storage: Good and Bad News o Good: You can store wafers, die, or packages o Wafers or hermetic parts: store in a dry environment. o Plastic finished goods require a dry environment with periodic monitoring. o Having spares essentially eradicates the problem of locating EOL/obsolete parts in the future. o Bad: May be prohibited by regulation (FAR). o Federal Acquisition Regulations (FAR) often limits procurement to one or two years. o Systems manufacturers have rarely funded this long-term procurement on their “own dollar.” © 2004 - 2007 2010
  • 28. Storage Options: Summary © 2004 - 2007 2010
  • 29. Long Term Storage Case Study o In this case study, solderability was assessed for: o Components from three different reels o Stored for up to five years to determine how much additional storage life was available. o Either an ASIC in a SOIC package or a MOSFET in a TO-252 package. o In both package styles, the lead frame plating was tin-based. © 2004 - 2007 2010
  • 30. Case Study (continued) o Type of plating material drives the appropriate solderability test o In this case, tin can either oxidize and/or form intermetallics with the base metal underneath. o Both reactions can detrimentally reduce the solderability of the component. o To assess these reactions, the components were subjected to steam aging to accelerate storage related effects on solderability. o Elevated temperature accelerates tin-copper intermetallic growth o Steam accelerates tin oxide formation. o Components were then tested for solder wettability using a wetting balance test. © 2004 - 2007 2010
  • 31. Steam Aging Apparatus and Approach • The steaming apparatus was constructed as per IPC-TR-464. • Components are placed in the “dead bug” position on an inert and heat resistant polypropylene stage. • With this method, components are held at approximately 93°C, between 80% and 90% relative humidity (RH), and no more than 1 1/2" from the surface of the boiling water. • Each day exposed to this accelerated steam aging method is considered equivalent to one year in storage. Three components from each reel were aged for 0, 12, 24, 48 and 72 hours, corresponding to 0, 0.5, 1, 2 and 3 years of additional storage. Apparatus for Steam Aging © 2004 - 2007 2010
  • 32. Solderability Measurements o Measurements of the wettability of the leads performed using a solder meniscus measuring device (Wetting Balance) for each component. o All parts were tested with a standard RMA flux. o Recommended procedure detailed in IPC/EIA J-STD-002C. o 3 components from each reel were tested. © 2004 - 2007 2010
  • 33. Solderability Measurements o The acceptance criterion from J-STD-002C is provided in Chart 1 below o Set A more stringent than Set B. © 2004 - 2007 2010
  • 34. Case Study Results o TO252 (production year 2003). Solderability is already impaired. o Dashed line indicates a part which was tested with a more active water soluble flux. Notice the significant improvement in wettability. o Suggests the mechanism for poor wetting is thick oxide (as opposed to intermetallic formation). Wetting Force DCC03994DC 400 350 300 Hours Aged 250 0 0 Force (uN/mm) 200 0 12 12 150 12 24 100 24 24 48 50 48 48 0 72 72 -0.5 0.5 1.5 2.5 3.5 4.5 5.5 72 -50 -100 time (seconds) © 2004 - 2007 2010
  • 35. Case Study Results o TO252 (production year 2000). Even though this part is older, initial solderability is superior to the 2003 part. o After 12 hours of steam aging (equivalent to six months), solderability has deteriorated. Wetting Force DK0060112G 400 350 300 Hours 250 Aged Force (uN/mm) 0 200 0 0 12 150 12 12 100 24 24 24 50 48 48 48 0 72 -0.5 0.5 1.5 2.5 3.5 4.5 5.5 72 72 -50 -100 time (seconds) © 2004 - 2007 2010
  • 36. Case Study Results o SOIC (production year N/A). Solderability degrades slowly. o The part does not become completely unwettable, like the TO252 parts, but fails IPC criteria after 24 hours of steam aging (equivalent to 1 year of storage). Wetting Force SOIC 400 350 300 Hours Aged 250 0 Force (uN/mm) 0 200 0 12 150 12 12 24 100 24 24 48 50 48 48 0 72 -0.5 0.5 1.5 2.5 3.5 4.5 5.5 72 72 -50 -100 time (seconds) © 2004 - 2007 2010
  • 37. Discussion and Conclusions o The same components produced by the same manufacturer can display very different behaviors in regards to long-term solderability. o This was seen with the TO252 parts, where the parts fabricated in 2000 had better wettability than the parts fabricated in 2003. o Therefore, any component or obsolescence storage strategy should involve an initial solderability assessment of each part and date code combination. © 2004 - 2007 2010
  • 38. Discussion and Conclusions o Any concern with poor solderability, if driven by oxidation formation, can be potentially mitigated through the use of more aggressive flux formulations. o This may require contingency planning for assembly of components after long-term storage, including movement from L to M to possibly H flux chemistries and introducing modified cleaning processes to ensure these chemistries are effectively removed after soldering. o It also clearly demonstrates that the most critical parameter to control during long-term storage is temperature, as oxide formation can be potentially remedied while intermetallic formation cannot. © 2004 - 2007 2010
  • 39. Long Term Storage Reliability Issues Intermetallics Stress driven diffusive voiding Tin whiskering Moisture Kirkendall voiding – 2010 © 2004 - 2007 2010
  • 40. Intermetallics / Oxidation o Intermetallic compounds form when two unlike metals diffuse into one another creating species materials which are combinations of the two materials. o Intermetallic growth is the result of the diffusion of one material into another via crystal vacancies made available by defects, contamination, impurities, grain boundaries and mechanical stress o There are a number of locations within the electronic package where these dissimilar metals are joined. o These include: o Die level interconnects, wire bonds o Plating finishes on lead frames o Solder joints, flip chip interconnects, etc... © 2004 - 2007 2010
  • 41. Intermetallics / Oxidation Growth of intermetallics during the storage period may occur and may reduce the strength or increase the resistance of the interconnect due to the properties of the intermetallic or from Kirkendall voiding. Intermetallic layer thickness can be estimated by following equation: X= Kt 1/2 Where X is the intermetallic layer thickness, t is the time and K is the rate constant which is calculated by following: K=Ce -E/KT Where C is the rate constant (there are nine different ones listed by Philofsky), e is the activation energy (typically 0.4 to 0.9 eV), K is the Boltzmann constant, and T is the temperature in absolute scale. © 2004 - 2007 2010
  • 42. Stress Driven Diffusive Voiding o Stress Driven Diffusive Voiding in on-die interconnects results from the mismatch in coefficient of thermal expansion between the dielectric layers and the metallization itself. o Aluminum has a very high coefficient of thermal expansion (~27 ppm/ºC) while SiO2 has a fairly low coefficient of thermal expansion (~4 ppm/ºC). o Since metal deposition operations during semiconductor manufacturing are performed at elevated temperatures, the metallization contracts as it cools, causing it to be in tensile state. o These tensile stresses relax over a period of time resulting in small movements (diffusion) of metal atoms. o This movement can result in a void or an open interconnect. © 2004 - 2007 2010
  • 43. Stress Driven Diffusive Voiding o Compressive stresses from the molding process can also cause movement of metallization atoms. This can cause thinning of the interconnect resulting in greater current densities during operation. o These current densities may be sufficiently high to cause electromigration which can also lead to an interconnect open. Image courtesy of Micron © 2004 - 2007 2010
  • 44. Tin Whiskers o A tin whisker is a single crystal growth that can occur on tin plated lead frames. o Mechanism for the growth is not clearly understood but it does appear to be related to compressive stresses in the plating, moisture, and contamination. o May be an issue for alloy 42 lead frames with pure tin platings since large compressive stresses are present due to the CTE mismatch between the alloy 42 and the tin. o Tin whiskers can lead to shorting, intermittent errors, and high frequency issues. © 2004 - 2007 2010
  • 45. Moisture o Depending on storage time & conditions, parts may be subjected to moisture. o May be from o Overloading of the desiccant with moisture o Failure of the storage bags o Improper storage. o Presence of moisture can lead to corrosion issues and other failures such as popcorning. © 2004 - 2007 2010
  • 46. Failure Modes Encountered With Stored Electronic Components Component Failure Modes Batteries Dry batteries have limited shelf life. They become unusable at low temperatures and deteriorate rapidly at temperatures above 35C. The output of storage batteries drops as low as 10 percent at very low temperatures. Capacitors Moisture permeates solid dielectrics and increases losses which may lead to breakdown. Moisture on plates of an air capacitor changes the capacitance. Coils Moisture causes changes in inductance and loss in Q. Moisture swells phenolic forms. Wax coverings soften at high temperatures. Connectors Corrosion causes poor electrical contact and seizure of mating members. Moisture causes shorting at the ends. Relays & Solenoids Corrosion of metal parts causes malfunctioning. Dust and sand damage the contacts. Fungi grows on coils. Resistors The values of composition-type fixed resistors drift and these resistors are not suitable above 85C. Enameled and cement-coated resistors have small pinholes which bleed moisture, accounting for eventual breakdown. Precision wire-wound fixed resistors fail rapidly when exposed to high humidities and to temperatures at about 125c. Diodes, transistors, and microcircuits Plastic encapsulated devices offer poor hermetic seal resulting in shorts or opens caused by chemical corrosion or moisture. Motors, Blowers, and Dynamotors Swelling and rupture of plastic parts and corrosion of metal parts. Moisture absorption and fungus growth on coils. Sealed bearings are subject to failure. Plugs, jacks, Dial-Lamp sockets Corrosion and dirt produce high resistance contacts. Plastic insulation absorbs moisture. Switches Metal parts corrode, and plastic and wafers warp due to moisture absorption. Transformers Windings corrode causing shorts or open circuits. © 2004 - 2007 2010
  • 47. Printed Circuit Board Storage o Common Pb-free board platings: o Electroless nickel/immersion gold (ENIG) o Immersion tin (ImSn) o Immersion silver (ImAg) o Organic solderability preservative (OSP) o Pb-free HASL o Failure mechanisms or quality issues are pretty well known at this point. o Black Pad with ENIG o Creep Corrosion with ImAg © 2004 - 2007 2010
  • 48. Printed Circuit Board Storage o If you have always used SnPb HASL plated boards, the biggest change will be storage times. o Except for ENIG, which many companies avoid because of cost, all alternative Pb-free platings should be limited to 12 months of storage. o Over time ImSn will form intermetallics (temperature), OSP-coated copper will oxidize (humidity), and ImAg will tarnish (gaseous sulfides). © 2004 - 2007 2010
  • 49. KIRKENDALL VOIDING o Another issue with board plating that also involves solder is Kirkendall voiding o Occurs when voids form at the interface between two dissimilar materials due to differential diffusion. If these voids coalesce, solder joint failure is more likely, especially under mechanical shock/drop conditions. © 2004 - 2007 2010
  • 50. General Storage Reliability Checklist © 2004 - 2007 2010
  • 51. Summary o Managing obsolescence issues is critical! o Anticipate and plan o Implement a robust long term storage program which considers: o Asset Security o Component Inspection o Product genealogy (origins) & condition o Storage Environment o Data Management o Assured Supply o Be aware of the potential reliability issues. © 2004 - 2007 2010
  • 52. Instructor Biography o Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs. o Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She holds leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer. o She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreach and volunteers with several organizations that specialize in encouraging pre-college students to pursue careers in these fields. © 2004 - 2007 2010
  • 53. Contact Information Any Questions? Contact Cheryl Tulkoff, ctulkoff@dfrsolutions.com, 512-913-8624 Connect with me on Linked In! www.dfrsolutions.com © 2004 - 2007 2010